Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Consultant / Service Provider
Buy and sell new and used equipment on a case by case basis
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
New Equipment | Rework & Repair Equipment
Flat Shockproof Vulcan Spudger SH-80 Double Beveled and Conical Ends. (6" x 1/4") The unique Beau Tech spudgers are made of special vulcanized fiber which has the most desirable mechanical, electrical, and thermal properties for appl
Electronics Forum | Fri Oct 23 13:33:24 EDT 1998 | Michael N
I need some info on how to stop the bridges I'm having on radial and axial parts that are in the same place on every board. I'm also having problems with sot-25 bridging. I'm using a Electrovert E-pak. I tried leveling the machine,solder pot, and th
Electronics Forum | Thu Jul 27 08:02:55 EDT 2000 | Jason
Hello once again! I am having a problem with a 24 pin connector bridging on the wave. We use very similar connectors on other PCB with zero problems. This connector bridges in the same place on the same pins. It forms like a little block of four
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Industry News | 2003-02-19 08:39:25.0
GSPK Circuits is Taking Courageous Steps to Bridge the Missing "complete supply solution" Service Gap to Benefit Its Customers by Investing in a Brand New Chinese Venture
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
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Parts & Supplies | Screen Printers
Product Name: P0890; MPMVC1; VC2; VC3 bridge flow reactor Part Number: P0890 Description: P0890; MPM VC1; VC2; VC3 bridge flow reactor; DIODE, MODULE, 25AMP, 200V Applicable models: UP; AP Printing Presses P0890; MPM VC1; VC2; VC3 bridge fl
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Parts & Supplies | Screen Printers
Product Name: P0890; MPMVC1; VC2; VC3 bridge flow reactor Part Number: P0890 Description: P0890; MPM VC1; VC2; VC3 bridge flow reactor; DIODE, MODULE, 25AMP, 200V Applicable models: UP; AP Printing Presses P0890; MPM VC1; VC2; VC3 bridge fl
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2006-11-14 12:48:31.0
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package
00367071-02 Adapter cable 1 SUB-D pin - 2 SUB-D sock 03048638-02 BOX 03048639-02 MAGAZINE FOR NOZZLE P+P / S-F-D 03048676-02 MAGAZINE COMP. /2 NOZZLES P+P / S-F-D 03048803-02 reject device nozzle changer 03048851-01 CABLE:VALVE
03048851-01 CABLE:VALVE LIFT.TABLE UP CONV.BOARD 03048852-01 CABLE:VALVE LIFT.TABLE DOWN CONV.BOARD 03048854-02 NOZZLE TYPE 1005 COMPL. ESD 03048858-01 El.-Mag.-Valve CPE10-M1BH-5/3G-QS6-B 03048867-01 Rectifier bridge 1200 V / 166A 03048868-01 R
Training Courses | ON DEMAND | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ON DEMAND | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Mon Jan 31 00:00:00 EST 2022 - Thu Feb 03 00:00:00 EST 2022 | Honolulu, Hawaii USA
Pan Pacific Microelectronics Symposium
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | hamtramck, Michigan USA | Production
• (from)2004 (to)2008 o Alterra Clare Bridge – Customer service, Dining Service Manager,Office Administrator #248-489-9362 . (from)2010 (to)2011 Yossi’s – Kitchen Manager, Pre Cook
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Bridging at Reflow, What is the Cause and Can it be Eliminated? SMTnet Express April 12, 2012, Subscribers: 25060, Members: Companies: 8851, Users: 32937 Bridging at Reflow, What is the Cause and Can it be Eliminated? by: Robert Dervaes, V
| https://www.eptac.com/soldertip/acceptability-of-conformal-coating-bubbles/
: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. As printed circuit boards have grown smaller and smaller over time, solder bridges can form more easily. Some of the common causes for solder bridging include
