Electronics Forum | Tue Jun 02 15:01:57 EDT 2015 | tombstonesmt
What is the reduction in aperture size for your stencil versus pad? Or are they at 100%?
Electronics Forum | Tue Jun 02 16:16:35 EDT 2015 | ldempsey
Well, I'm speaking in general Our stencil guy insists on those part edits at 100% He's one of the loudest voices calling for me to "Stop slamming the parts into the PCB" All my research so far says we need to be looking at the stencil apertures.
Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey
Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas
Electronics Forum | Wed Jun 03 15:45:36 EDT 2015 | ldempsey
Well, it took me a while but I had a look at some gerbers. On a PCB with neighboring 0402's 0.006" apart, and paste reduced 0.75mil on each side, I get lots of bridging. On a later rev of the same PCB, we have neighboring 0402's 0.018" apart,and pa
Electronics Forum | Tue Jun 02 13:42:44 EDT 2015 | ldempsey
Hello all, Some background. We have JUKI machines (FX2, KE2000's and KE3000's) We're looking into an issue with 0402's in close proximity to each other. The paste gets mashed into the paste from adjacent parts. Some have suggested I deviate from
Electronics Forum | Wed Nov 07 07:31:20 EST 2001 | steven
what is ideal or minimun spacing in between 2 pads to avoid bridging? thanks
Electronics Forum | Tue Jun 28 13:04:08 EDT 2005 | slthomas
Are you saying that increasing the frequency of cleaning to every 3 boards *reduced* bridging, or that it's just something you tried? I don't understand why that would help(in my experience it has reduced "insufficient solder" conditions but not brid
Electronics Forum | Wed Nov 07 17:10:15 EST 2001 | davef
If you don�t paste / reflow solder on the pads, they will never bridge. ;-) A design with a 0.13mm gap between pads will challenge equipment, materials, and process.
Electronics Forum | Wed Nov 07 18:37:27 EST 2001 | steven
sometime hand solder can cause also. no necessary have to be paste n reflow.:) now i'm facing bridging on 0402 components pads. any suggestions on spacing distance as we're going to re-design the pcb.
Electronics Forum | Sat Jun 25 10:04:08 EDT 2005 | ktron
Hi MSK, Stencil thickness: 5mils with laser cut Smallest pitch: 20mils Underscreen cleaning frequency: 10 bds per cleaning Note: We have decreased the cleaning frequency from 10 boards to 3 bds to reduce solder bridging after printing Regards,
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