Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House
Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y
Electronics Forum | Sun Jan 09 20:44:10 EST 2022 | davef
Most boards are fabricated with 1-ounce copper [34.79µm (micron/micrometer)]. Foil more commonly comes in at 33µm or less. Processing reduces this down to 30µm or thinner. Talk to your board fab about the specifics of your application
Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef
First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef
You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2
Electronics Forum | Wed Oct 18 07:51:14 EDT 2006 | davef
Look here: http://www.circuittechctr.com/ As a low cost approach, use copper foil purchased from a stained glass window hobbyist shop. Cut foil pieces to size with a sharp knife. Epoxy the pieces in place of the damaged pads. Tin and then solder th
Electronics Forum | Wed Apr 24 21:33:02 EDT 2019 | pcbindex1
With the upcoming of the traditional peak season(Q3), a rising price among the mainland factories, and a continual rise in the bronze price in the London Metal Exchange in August, there is also a trend for the rise in the quotation of the PCB’s upstr
Electronics Forum | Thu Mar 16 04:35:49 EST 2006 | vicknesh28
Paste is eutectic and it's copper based parts. Just another observation, i notice that the "flux" between the bottom foot and solidified paste is still in gluey state. Observation on good reflowed leads showed brittle type of flux residue. Can anyone
