Industry Directory | Distributor
Tecono was founded 1990 and has since the start supplied the electronic industry with equipment, material and technical support.
Industry Directory | Manufacturer
Design, development, and manufacture of soldering, desoldering, rework systems and tools for the electronics industry.
New Equipment | Component Counters / SMD Counters
Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows: These are the components package specifications. Functions: 1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg
Yamaha YSM10 Pick and Place High-speed Modular SMT Placement ❙ Features of Yamaha SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT pick and place machine, Yamaha chip mounter, for SMT assembly system. pleas
Electronics Forum | Wed Mar 30 08:06:17 EST 2005 | davef
Considerations are: * If the nonwetting is component lot specific, the could be solderability issues with that lot. * If the nonwetting is is a broader based component issue, the solderability protection on the component may require a different reflo
Electronics Forum | Thu Feb 18 08:35:10 EST 1999 | Dave F
| We have problems with solder balls after reflow. Anybody have any ideas as to what causes them? | Al: Tuffty's comments are good, but point to the broader problem in trying to make recommendations on your problem ... There's just not enough info
Used SMT Equipment | In-Circuit Testers
The Agilent 4294A precision impedance analyzer is an integrated solution for efficient impedance measurement and analysis of components and circuits. The Agilent 4294A covers a broader test-frequency range (40 Hz to 110 MHz) with Basic impedance accu
Used SMT Equipment | In-Circuit Testers
Fluke 9640A 4 GHz RF Reference Source A unique combination of level accuracy, dynamic range and frequency in a single instrument The Fluke 9640A and 9640A-LPN Reference Generators feature a unique combination of level accuracy, dynamic range
Industry News | 2003-03-10 08:33:30.0
For the manufacture of Power Commander cable assemblies.
Industry News | 2022-02-10 16:41:20.0
Says action must be paired with rebuilding the broader European electronics manufacturing ecosystem
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Technical Library | 2011-10-06 13:59:04.0
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.
Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows: These are the components package specifications. Functions: 1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg
4-Position Tilt Accessory for the SC-300 Conformal Coating Applicator
Career Center | Dallas, Texas USA | Management,Production
Supervises an assigned work shift of 20+ employees. Typically has department group leaders as reports. Responsible for quality, quantity of work output and continuous improvement of product and/or processes. Establish, define, document and moni
Career Center | Tewksbury, Massachusetts USA | Engineering
Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech
Career Center | Fallbrook, California USA | Sales/Marketing
I have over 5 years of experience as the Asian Regional Vice President of Sales and Marketing for the Siemens SMT equipment division, over 7 years as the President of a small international Manufacturers Representative business selling SMT machines in
Imagineering, Inc. | https://www.pcbnet.com/blog/dissolving-barriers-how-water-soluble-printed-circuit-boards-could-solve-e-waste/
. Soluble PCBs promise to mitigate this with a design focused on renewability. Overall, the development of Soluboard and similar materials reflects a broader commitment to responsible product life cycles worldwide
| https://www.eptac.com/blog/understanding-bare-board-inspection-an-essential-quality-control-measure
. Bare Board Inspection in the Broader Context of PCB Manufacturing and Quality Control Bare board inspection, while an essential quality control measure in its own right, does not function in isolation
