New Equipment | Rework & Repair Equipment
We also provide X-ray inspection and X-ray counter for SMT. Contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 skype:ritaleeli Email:ritaleeli0809@gmail.com 2018 top selling mobile phone motherboard chip repairing tools ZM-R6200 optical BGA
New Equipment | Rework & Repair Equipment
We provide SMT inspection and repairing equipment, you are welcome to contact Rita Li by: whatsapp:0086 134 3448 1030 SKype:ritaleeli Email:sales11@zhuomao.com.cn App
Electronics Forum | Wed Jul 24 07:18:12 EDT 2002 | lloyd
Hi, We occasionaly have problems with some of our panellised boards breaking away from each other. The section joining them is very small and makes the assembly weak. The boards are normally broken off during our through hole process (bad handling)
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2010-01-05 14:02:24.0
MADISON, AL — January 2010 — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its Training Services Department has broken its all-time sales records in 2009.
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2466-multiple-voids
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes MULTIPLE VOIDS MULTIPLE VOIDS Flip Chip Underfill Multiple Voids
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) Conductor lifted from board or substrate. (b-5) Fracture within board or substrate. c. For flip-chip configurations: (c-1) Failure in the bond material or pedestal, if applicable. (c-2) Fracture of die (or carrier) or substrate
