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3500/05 System Rack Description The 3500 System rack design holds all 3500 monitor modules and rack power supplies. It allows the various 3500 modules to communicate with one another and the power supplies to distribute power to each module as requ
Electronics Forum | Fri Jan 13 06:43:20 EST 2006 | cyber_wolf
How would you like to have this guy evaluate your reflow profile? It was in response to an auditor who require someone they had monitor temperature in both Fahrenheit and Celcius. What a geek Don't put him on the spot. That is not a good thing to
Industry News | 2014-05-27 10:56:19.0
ISVI Corp. has announced the signing of a distribution agreement with Virtech Labs Bt. to promote and sell its high-speed, high-resolution cameras to the Hungarian machine vision market.
Industry News | 2021-08-20 03:43:38.0
Don't miss Seica's Pilot Battery Tester (PILOT BT) demonstration at The Battery Show in Novi, Michigan, September 14-16, in booth 3036! Seica will demonstrate the testing of battery cells in an inline test configuration with its Pilot BT. With its impressive parallel testing architecture, the Pilot BT can test 16 cells simultaneously to readily meet the throughput requirements of very high-volume production environments with an incredible test rate. The standard system configuration includes a pass-through conveyance by Bosch, but it can also be configured with unique customer conveyance solutions integrated into completely automated lines. The Pilot BT offers a very large test area (1050 x 865 mm) not only enabling it to handle the many battery configurations currently on the market, but the capacity to manage the configurations of the future. The Pilot BT is equipped with high-definition cameras and laser sensor to ensure proper fiducial recognition of the battery and terminal plates for proper battery placement inside the test area. No matter the battery technology, type, size or shape, Seica has a solution for high production, reliable, and repeatable test.
E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E9631721000 LAHD SENSOR E9631729000 AC SERVO MOTOR(AC30W) E9632700000 RS232 CABLE E9632715B00 ZIPPER TUBE (GPJ-20) E963271
JUKI 503 507 nozzles JUKI E9635455000 REVISION SEAL JUKI E9635721000 FOCUSED MODULAR JUKI E9635725000 FOCUSE MODULAR LA UNIT JUKI E9635729000 PC joinER 8 CORES JUKI E9635755000 SPEED CONTROLLER FW231 JUKI E9636721000 FMLA SENSOR JUKI E96367250
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
E9635721000 FOCUSED MODULAR E9635725000 FOCUSE MODULAR LA UNIT E9635729000 PC joinER 8 CORES E9635755000 SPEED CONTROLLER FW231 E9636721000 FMLA SENSOR E9636725000 FMLA SENSOR(TOP CONNECTOR) E9636729000 OCC CAMERA LENS E9637721000 LA P