Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
Electronics Forum | Mon Mar 25 13:48:52 EST 2002 | bcceng
We are currently applying solder bumps to hundreds of BCC's for rework. It is impossible to print to the PWB. It is recommended to apply solder bumps to the BCC's with 63/37 alloy making the rework faster and easier. Applying the solder bump on the
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | Labeling Systems
CBP / TP 5Kg Cold Bump Pull/ Tweezers Pull Cartridge along with JAW Nordson Dage 4000 Bond Tester DAGE 4000 CBP/TP 5KG Qty:2 Condition : Excellent working condition with many Modules all form Europe user Email:13560819457@139.com
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-01-27 10:27:31.0
At a New Facility Within the Company's U.S. Headquarters
Parts & Supplies | Component Packaging
Product Name: Philips smt feeder charging platform(with power supply) Product Size (mm): L120*W230*H250 Brand:Philips Devices Number : Install one FEEDER Applicable models: Philips Series models Weight: About 6KG This product is made of painted
Parts & Supplies | Pick and Place/Feeders
Product Description: Product Name: Philips smt feeder station(with power supply) Product Size (mm): L120*W230*H250 Brand:Philips Devices Number : Install one FEEDER Applicable models: Philips Series models Weight: About 6KG This product is ma
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Nano-copper sintering in formic acid vapor.
CY-206 knife type splitting machine adopts straight knife design under the upper round knife. When the cutting board is cut, the v-cut is placed on the lower straight knife, the circuit board does not move, the upper circular knife moves the cutting
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Brookfield, Wisconsin USA | Engineering
SR. ENGINEER � SENSORS -- $60-$80K Company: Well established controls manufacturer that has seen steady growth over the past several years. This company has a history of anticipating and successfully capitalizing on new market needs. Being one of t
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-reballing-service
. Home Catalog Blog About us Home › BGA Reballing Service BGA Reballing Service $25.00 Default Title - $25.00 USD Quantity Add to Cart BGA Reballing services and Solder Bumping services for all types of BGA's, QFN's, LGA's and other SMD devices
Heller 公司 | https://hellerindustries.com.cn/semiconductor-advance-packaging/
半导体先进封装 » 半导体先进封装 半导体先进封装 HELLER Industries为半导体先进封装应用提供多种解决方案，如植球（Bumping)、芯片粘接(Die Attach)、底部填充固化(Underfill)、盖子粘接((Lid Attach)和球粘接(Ball Attach)。我们为晶圆、框架晶圆、玻璃面板和其他基板提供多种洁净室等级选项和一系列自动化选项。将您的焊接或固化挑战带给我们，我们经验丰富的工程师随时准备为您提供定制的解决方案。 球粘接(Ball Attach) 典型的球粘
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