Battery Holders, Coin Holders, Button Holders, battery hardware, Battery Contacts, AA Holders, AAA, holders, 12 volt Auto plug in assemblies, 12 volt plugs, 12 volt sockets, audio connectors, DC Plugs, DC Jacks, Fuse Holders, 9 volt clips
Industry Directory | Manufacturer
JINSUNG ELECTRONICS CO. designs and manufactures the customized Printed Circuit Board(PCB) based in South Korea since 1995 throughout types of Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex.
New Equipment | Assembly Services
1. PCB transmission machine: For the connection between SMT production lines, Du can also be used for PCB buffering, inspection, Zhi test or manual insertion of electronic components. 2. Application range: dao50mm-500mm wide PCB board. 3. Responsi
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Tue Feb 21 01:32:49 EST 2017 | soldertraining
Looking for advice on soldering lead free paste to a board with very heavy gold plating, In my opinion, Gold contact surfaces are often used on circuit boards with membrane switches which is a choice of technology for industrial, commercial and consu
Used SMT Equipment | THT Equipment
Odd-Form Component Insertion Machine CME-1 The Odd-Form inserting machine mounts non-standard parts, which greatly improves the efficiency. Our experienced technical team has developed feeders and nozzles suitable for various special-shaped parts
Used SMT Equipment | In-Circuit Testers
The E4406A VSA transmitter tester is a full-featured vector signal analyzer ideally suited for base station and mobile handset manufacturing, with additional applications for design and development of wireless equipment. The E4406A VSA offers high pe
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
Industry News | 2003-03-11 08:28:59.0
To cooperate in the development of flexible circuit technology incorporating proprietary printing and plating technologies.
Parts & Supplies | SMT Equipment
YAMAHA KHY-M221A-A0 COVER,DUCT ASSY. YG12 YS12 1-1 KHY-M221A-A0 COVER,DUCT ASSY. 1 2 KGT-M2266-10 PLATE,NUT 1 3 KGT-M2268-00 BRACKET 1,TAPE 1 3-1 KHY-M2268-00 BRACKET 1,TAPE 1 4 KHN-M22F8-00 WASHER,SWR08 16 5 KHW-M2269-00 BRACKET 2,TAPE 1
Parts & Supplies | SMT Equipment
YAMAHA KHY-M221A-A0 COVER,DUCT ASSY. YG12 YS12 1-1 KHY-M221A-A0 COVER,DUCT ASSY. 1 2 KGT-M2266-10 PLATE,NUT 1 3 KGT-M2268-00 BRACKET 1,TAPE 1 3-1 KHY-M2268-00 BRACKET 1,TAPE 1 4 KHN-M22F8-00 WASHER,SWR08 16 5 KHW-M2269-00 BRACKET 2,TAPE 1
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
J7066214A ROLLER SHAFT-32 J7066268A ROLLER SHAFT-44 J7066218A TAPE LOADER-32 J7066271A TAPE LOADER-44
J7066214A ROLLER SHAFT-32 J7066268A ROLLER SHAFT-44 J7066218A TAPE LOADER-32 J7066271A TAPE LOADER-44
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Apr 07 00:00:00 EDT 2022 - Thu Apr 07 00:00:00 EDT 2022 | Palm Bay, Florida USA
Space Coast Chapter Technical Meeting: Printed Wiring Board Fabrication Design Attributes
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Career Center | Central, Hong Kong | Engineering,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
We have lots of PCB manufacturing openings: SMT Engineers/Managers Plating Engineers/Managers Quality Engineers/Managers Process Engineers Supply Chain Directors Lots of jobs in Injection Moulding: Business Development Directors
Career Center | Los Angeles, Dallas, Atlanta, Texas, Georgia USA | Sales/Marketing
Client company seeks sales managers (3 Locations)who will develop a sustainable and profitable level of revenue growth for an exciting organization who has the ability to completely control the supply chain for its clients in the electronic OEM marke
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/how-to-specify-plated-holes_topic1400_post5615.html
-calculate the pad stack Select the Pad shape Then select the ADD button to add the new pad stack to the list For the surface mount Tab you enter the X
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. Supply of all powers except for the power to a computer is ceased. The emergency stop status can be released by turning the ‘EMG’ switch in the direction of the arrow and pressing the RESET button
