New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
The C4ISR Power Distribution Unit (PDU) is a combat proven rugged vehicle mounted assembly providing filtered, circuit breaker protected, DC power to vehicle communications, intercom, jamming and other sensitive electronic equipment. The PDU inclu
Electronics Forum | Tue Dec 20 16:47:22 EST 2005 | toml
Parameters -> Cameras) Look at the camera serial tag and you should see C4 or OAL or C4 OAL. Make sure the camera type is set to strobed RS170 (C4) or whatever type you have. Then set defaults for this camera, and power cycle. This will fix the f
Electronics Forum | Thu Sep 21 14:15:09 EDT 2006 | lheiss
A list would be great. Thanks, Larry lheiss@speastech.com
Used SMT Equipment | SMT Equipment
Model :JX-200 Placement speed:Chips:18050CPH(0.199sec/chip) Component mount range:0603 chips ~33.5mm Station:60 Power supply:3-phase AC200~415C 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg If any more requirement ,pls send me email to sher
Used SMT Equipment | SMT Equipment
Model :JX-200 Placement speed:Chips:18050CPH(0.199sec/chip) Component mount range:0603 chips ~33.5mm Station:60 Power supply:3-phase AC200~415C 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg
Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
Parts & Supplies | SMT Equipment
CM123 CPU BOARD (N209NBC1C4BM)
Parts & Supplies | SMT Equipment
CM123 CPU BOARD (N209NBC1C4BM)
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
SENSOR ANALOG -55C-150C 4DSBGA Manufacturer: Texas Instruments Applications: - Internet of Things (IoT) Sensor Nodes - Industrial RTD (Class AA) or Precision NTC/PTC Thermistor Replacement - Medical/Fitness Equipment - Medi
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