Industry News | 2009-04-15 22:46:55.0
BANNOCKBURN, Ill., USA, April 14, 2009 � �This is a very exciting time �� � not exactly words often heard these days, but according to David Buhrkuhl, president of SPEA America, even within these economic times, �new technologies are driving the industry,� and opportunities do exist. At the recent IPC APEX EXPO� in Las Vegas, the opportunities for learning and business development were ever-present. Despite attendance figures lower than last year, 6,077 attendee and exhibitor individuals from 42 countries gathered together to take advantage of the educational sessions, standards committee meetings and business development activities on and off the exhibit floor.
Industry News | 2014-02-18 17:01:34.0
The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.
Industry News | 2015-03-02 11:42:19.0
The SMTA is pleased to announce the program for the 9th Annual International Conference on Soldering and Reliability being held May 19-21, 2015 in Markham, Ontario, Canada. The event will be co-located with the SMTA Toronto Expo.
Industry News | 2013-01-17 11:15:42.0
One of the “cleanest” areas on the IPC APEX EXPO® show floor will be found at the IPC/NPL Cleaning and Contamination Testing Center
Industry News | 2012-12-03 19:52:39.0
Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2016-09-29 20:30:17.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2022-09-26 07:17:35.0
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, received a 2022 Mexico Technology Award in the category of Test Equipment for its AutoCAF2+ and CLRHV Bridge. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2018-12-13 10:32:16.0
SIR and CAF testing have become significant demands by the industry in the drive to improve and enhance electronic circuit reliability.
