Innovation, performance and flexibility driven specifically toward the needs of the Automotive, Smartphone and Semiconductor markets. The Camalot® Prodigy™ dispensing system employs breakthrough technology innovations to enable higher proc
Electronics Forum | Tue Dec 21 09:22:52 EST 2010 | cwhite30
I have a camalot 1818 dispensing system, but it recently stopped booting up. It gets to the 197 vision initialization screen and then freezes with the message "bad command or file name could not communicate with vp" Does anyone know how to fix this?
Electronics Forum | Thu Oct 20 00:46:43 EDT 2005 | bigvern
Hi can anyone advise as to wether the Camalot Gemini 1 dispenser is capable of doing lines and circles as well as the high speed dots. The facility appears to be there in the software, just wondered whether anyone had tried.
The CAM/ALOT 5000 Liquid dispensing system provides hign-speed adhesive or solder paste dispensing for applications involving large boards or multi-up panels: ● 25,000 dots per hour for 50 mil pitch solder paste ● 22,000 dots per hour for 3mm pi
Nicely maintained glue dispenser loaded with accessories. 642 pump. Travel X-axis: 19.00" (483mm) Travel Y-axis: 19.00" (483mm) Travel Z-axis: 1" (25mm) Resolution: 0.001" (25 microns) Repeatability: +/-0.002" (+/-50 microns) with linear motors
Industry News | 2016-03-22 17:01:09.0
BajaBid Europe announces that they will be hosting one of Europe’s Largest Online Electronic Manufacturing Equipment Auctions on 29th – 31st March. The Auction has over $1 million of surplus equipment.
CAMALOT dispenser adapter card 49728 CAMALOT dispenser adapter card 49728 SPEEDLINE accessories MPM /CAMALOT solenoid valve 1022629 XPM3 control card/upgrade control box AI/DI/ 3151520 Camalot dispenser sensor 1021496/1 SPEEDLINE accessories M
Technical Library | 2011-12-22 16:45:49.0
This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate ch
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
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