Technical Library: camelot and dispenser (Page 1 of 3)

Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing Systems

Technical Library | 2013-11-14 10:43:40.0

Understanding accuracy and repeatability is an important step to analyze fluid dispensing system performance. They can also be prone to misinterpretation when reviewing a product specification. A dispensing motion system can be made to perform better or worse under different operating conditions. This article will explain accuracy and repeatability, and how they can be applied to different specifications. It will also discuss key considerations when interpreting accuracy and repeatability for decision making.

Nordson ASYMTEK

Dam and Fill Encapsulation for Microelectronic Packages

Technical Library | 1999-08-27 09:29:49.0

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...

Nordson ASYMTEK

Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

Metcal

BTC and SMT Rework Challenges

Technical Library | 2019-05-22 21:24:05.0

voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance

kurtz ersa Corporation

Design and Experiment of a Moving Magnet Actuator Based Jetting Dispenser

Technical Library | 2021-01-13 21:29:27.0

Developing actuators to drive high-frequency jetting dispensers in the dispensing technology for electronic assembly applications has become a concern in recent years. This study proposed a new jetting dispenser without a displacement amplification mechanism directly actuated by a moving magnet actuator (MMA) to jet small fluid droplets. In this article, the main geometric dimensions of ...

National Cheng Kung University

Article Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

Technical Library | 2017-12-27 22:52:43.0

To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process.

Jilin University

Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials

Technical Library | 2019-02-27 15:23:47.0

A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability.

Northrop Grumman Corporation

The Characterization and Comparison of Spray Fluxers

Technical Library | 1999-04-26 11:52:34.0

An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results.

Siemens Process Industries and Drives

Status and Outlooks of Flip Chip Technology

Technical Library | 2018-11-14 21:43:14.0

Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.

ASM Pacific Technology

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

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