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New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s - Dri
Electronics Forum | Thu Nov 21 01:01:33 EST 2002 | chao liang
Who had building the f4g and c/c server , when I set up the f4g and the c/c server I found them could not transportion , The FTP could work in normal ,the error code is 417c0021 :c/c connection to failed ,[cann't connect local socket [ connect :10060
Electronics Forum | Thu Nov 21 01:02:06 EST 2002 | chao liang
Who had building the f4g and c/c server , when I set up the f4g and the c/c server I found them could not transportion , The FTP could work in normal ,the error code is 417c0021 :c/c connection to failed ,[cann't connect local socket [ connect :10060
Industry News | 2019-11-15 15:07:04.0
As intelligent industrial manufacturing gains a stronger foothold in production alongside the more established customization/prototyping arenas, Clariant returns to this year’s formnext with new solutions to support the growth. A new halogen-free flame retardant 3D printing material takes center stage alongside eye-catching and unique printed end use parts from a range of applications.
Industry News | 2021-09-06 04:37:34.0
The hiring program will prioritize people with disabilities, formerly incarcerated individuals, and other groups with high unemployment rates.
Parts & Supplies | Coating and Encapsulation
Tray Unit-M The Tray Unit-M is set on a feeder pallet This unit cann be set on M6II, M6IISP, M6(S) modules and the AIM. Tray Size(L*W) Without tray drawer: 135.9*115.5 to 135.9*322.6mm With tray drawe:50*50 to 102*204mm Maximum part type capa
Parts & Supplies | Pick and Place/Feeders
Tray Unit-M The Tray Unit-M is set on a feeder pallet This unit cann be set on M6II, M6IISP, M6(S) modules and the AIM. Tray Size(L*W) Without tray drawer: 135.9*115.5 to 135.9*322.6mm With tray drawe:50*50 to 102*204mm Maximum part type capa
Technical Library | 2018-08-22 14:05:42.0
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.
McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram,
