Industry Directory: cap 0 (3)

Cocor Aero Products, Inc.

Industry Directory | Other / Manufacturer's Rep

A Canadian corporation offering sales & marketing services to world-class manufacturers wishing to establish and expand their business presence in the Canadian aerospace & defence sectors and other related hi-tech sectors.

Pal Distributors

Industry Directory |

Diverse product list including: shipping/packaging supplies, stretch wrap, tapes, polyfoam & bubble wrap (available in antistatic), custom end caps, labels, barcodes, thermal printers, scanners, acrylic displays, sealers, machines

New SMT Equipment: cap 0 (2065)

6ES7194-4JD50-0AA0 ET200PRO CAPS FOR PUSH PULL SOCKETS 5PCS

6ES7194-4JD50-0AA0 ET200PRO CAPS FOR PUSH PULL SOCKETS 5PCS

New Equipment | Industrial Automation

Contact  Freely Manager: Leeta Wu Email: sales2@cambia.cn company website:www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Warranty: one year Condition: brand new and original Delivery t

Cambia Automation Limited

6ES7194-4JD50-0AA0 ET200PRO CAPS FOR PUSH PULL SOCKETS 5PCS

6ES7194-4JD50-0AA0 ET200PRO CAPS FOR PUSH PULL SOCKETS 5PCS

New Equipment | Industrial Automation

Contact  Freely Manager: Leeta Wu Email: sales2@cambia.cn company website:www.cambiaplc.com Mobile: +86 15960236674 Skype: +86 5960236674(Whatsapp/ Wechat) You Want to Know Warranty: one year Condition: brand new and original Delivery t

Cambia Automation Limited

Electronics Forum: cap 0 (1208)

ceramic cap crack

Electronics Forum | Sat Jun 19 08:32:49 EDT 2010 | davef

Please describe the location and appearance of the crack

ceramic cap crack

Electronics Forum | Mon Jun 21 12:02:36 EDT 2010 | roland_grenier

check your de-panelling process if you are using break-out tabs or V scoring.

Used SMT Equipment: cap 0 (19)

Fuji CP643E

Fuji CP643E

Used SMT Equipment | Chipshooters / Chip Mounters

FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca

Baja Bid

Fuji CP643E

Fuji CP643E

Used SMT Equipment | Chipshooters / Chip Mounters

FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca

Baja Bid

Industry News: cap 0 (134)

Techcon Systems Introduces Blue End Caps for Syringe Barrels

Industry News | 2011-06-28 15:28:57.0

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new Blue End Caps for Syringe Barrels.

Techcon Systems

Techcon Systems Debuts Stand-Up Tip Caps for Syringe Barrels

Industry News | 2011-06-16 14:35:57.0

Techcon Systems, a product group of OK International introduces the new Stand-Up Tip Caps for use with luer lock syringe barrels.

Techcon Systems

Parts & Supplies: cap 0 (2842)

Panasonic 02157040101 Nozzle Body

Panasonic 02157040101 Nozzle Body

Parts & Supplies | SMT Equipment

1048329012 HEATER N610103817AA Heater unit 102154502001 Heater unit 1048309069 JUINT HDF 10483S0008 HDF Holder 102664801203 102664801213 HDF Ball Spline 10483S0011AA HDF Holder 104839018901 Collar 104830903501 Cap 1044310025 0-Ring

KingFei SMT Tech

Panasonic 104083908301 Shaft

Panasonic 104083908301 Shaft

Parts & Supplies | SMT Equipment

1048329012 HEATER N610103817AA Heater unit 102154502001 Heater unit 1048309069 JUINT HDF 10483S0008 HDF Holder 102664801203 102664801213 HDF Ball Spline 10483S0011AA HDF Holder 104839018901 Collar 104830903501 Cap 1044310025 0-Ring

KingFei SMT Tech

Technical Library: cap 0 (94)

SMT007-MIRTEC Intelligent Factory Automation Article-November 2020

Technical Library | 2020-12-02 20:36:54.0

Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.

MIRTEC Corp

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: cap 0 (25)

Juki ELECTRIC 32mm FEEDER

Videos

E1420717000 S LINEAR WAYS E150770600B  LEVER CAP 05 E150770600C  LEVER CAP 08 E1507706C00  LOCK HOLDER E1507706C0D  LEVER CAP 081P E1507706C0E  LEVER CAP 08HE E2526715000  TC BLOCK E2527715000  VAC UNIT BRACKET E2530715000  TEACHING CAMERA SP

Qinyi Electronics Co.,Ltd

Juki CF05HP 8x2mm Feeder

Videos

E1415717000 S TENSIONER SH E1416717000 S TENSIONER E1416719000 SHUTTER LEVER SPRIN E1416729000  SCW PLATE FUC E1417719000 PICK UP LEVER SPRIN E1417729000  SCW PLATE RC E1418719000 HOOK SPRING E1418729000 SCW PLATE FU 30C E1418729000  SCW PLAT

Qinyi Electronics Co.,Ltd

Training Courses: cap 0 (2)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Career Center - Resumes: cap 0 (4)

Engineer- SMT

Career Center | , | 2013-01-31 04:29:34.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Engineer- SMT

Career Center | , | 2013-01-31 04:45:28.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Express Newsletter: cap 0 (215)

Partner Websites: cap 0 (879)

Samsung SM8*2 8MM Feeder J70650988B Link Shaft Cover 0 1 0 1 0 00 SM1-MF08-051R1

| http://www.smtspare-parts.com/sale-11395547-samsung-sm8-2-8mm-feeder-j70650988b-link-shaft-cover-0-1-0-1-0-00-sm1-mf08-051r1.html

Samsung SM8*2 8MM Feeder J70650988B Link Shaft Cover 0 1 0 1 0 00 SM1-MF08-051R1 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

Chip Cap Naming - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/chip-cap-naming_topic949_post3583.html

: 20 Mar 2012 Location: Dayton, Ohio Status: Offline Points: 43 Post Options Post Reply Quote SteveASmith Report Post    Thanks(0)    Quote    Reply Topic: Chip Cap Naming     Posted: 28 May 2013 at 12:29pm I believe that comes from an old

PCB Libraries, Inc.


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