Industry News: card carrier (Page 1 of 3)

InDigiNet To Acquire 2.5million in Assets

Industry News | 2003-05-08 07:11:45.0

InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.

SMTnet

SMTA, Donald Stevens Congress Center, Rosement, IL, September 27-28, Booth # 136

Industry News | 2016-08-13 19:54:46.0

JTAG Technologies return to SMTA in 2016 to premiere several new hardware products for PCB testing and In-System [Device] Programming.

Surface Mount Technology Association (SMTA)

Cobar Europe Introduces New Products from Yincae Advanced Materials

Industry News | 2010-09-16 21:44:04.0

The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.

Cobar Solder Products Inc.

WORLD'S FIRST SUPER FAST LOW TEMPERATURE UNDERFILL

Industry News | 2014-06-30 14:25:43.0

YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.

YINCAE Advanced Materials, LLC.

SMT 88UH Fast Cure, Reworkable Underfill

Industry News | 2014-07-08 11:04:03.0

YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.

YINCAE Advanced Materials, LLC.

World’s Best Flip Chip Underfill: SMT 158 Series

Industry News | 2014-08-12 16:03:12.0

(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.

YINCAE Advanced Materials, LLC.

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

Industry News | 2018-05-14 10:30:22.0

The world's first commercial diamond filled underfill.

YINCAE Advanced Materials, LLC.

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Industry News | 2018-09-04 15:51:06.0

YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.

YINCAE Advanced Materials, LLC.

PCIexpress PMC Carrier

Industry News | 2008-05-19 17:43:48.0

Now Shipping from Dynamic Engineering

Dynamic Engineering

Qualcomm Detects Error With 3G Chip Sets

Industry News | 2002-04-05 08:29:22.0

Detected an Undisclosed Error With Its CDMA2000 1X MSM5100 and MSM5105 Chip Sets and Software

Qualcomm Personal Electronics

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