Electronics Forum | Fri Feb 15 00:39:09 EST 2002 | Jones
I've noticed that after we have switched to Transition Automation blades on our MPM screen printers that the stencils seem to be wearing out faster and I see a wavy rippling effect across the length of the stencil thats impacted by the squeege blade.
Electronics Forum | Fri Jan 10 15:02:03 EST 2003 | John
Hi. I am familiar with the Transition blades. Normally, when there is metal to metal contact, as in the squeegee-stencil situation, there will be scratches, or a "brush pattern". Sometimes it takes the pattern of the high profile surface elements u
Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko
Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir
Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj
All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Thu Jul 20 16:56:38 EDT 2000 | Bob Willis
What do you mean good morning, my wine bottle is empty and I feel like sleeping. When will some one invite me back to your country to work again ? I need to do some more diving ? The most common cause is simpley the flux on the surface of the joint.
Electronics Forum | Thu Jul 20 16:45:54 EDT 2000 | Darby
Good morning Bob. Darby from Australia here. We sometimes see an orange peel type finish on our reflow solder joints when viewed under the microscope. Any ideas on what causes this ? Should I worry about it. I use a straight rise profile ( no "platea
Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
Electronics Forum | Wed Oct 10 12:04:54 EDT 2007 | russ
everything else EXACTLY the same? meaning exact same product number from the same manufacturer same fluxes used in the paste? no additional no clean "touchup" or hand soldering operations? No expert by any means but it would seem odd to me that the
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
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