Gold embrittlement of solder joints has been a concern for many decades. SEM Lab, Inc. supports evaluation for this condition. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. https://s
Simple, easily applied, and effective methods, materials and instrumentation will save you big and hidden expenses incurred to pay for production rejects and unexpected, post shipment guarantee repairs caused by Electrostatic Discharge. Professional
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Fri Apr 12 15:10:00 EDT 2002 | jsherrow
IMHO it's caused by three things: 1) placement 2) placement 3) placement
Industry News | 2021-09-02 06:10:22.0
MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
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Parts & Supplies | Pick and Place/Feeders
Samsung nozzle of TN series & CN series Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product description: Samsung nozzle of TN series & CN sereis Issues related to improper nozzle/f
Parts & Supplies | Storage Equipment
SMT Siemens feeder 88mm FEEDER 00141070 used in smt machine Specification Part Numbre 2x8mm FEEDER 00141096 3x8mm Gold FEEDER 00141099 3x8mm Silver FEEDER 00141098 3x8mm SL FEEDER 00141088 12/16MM FEEDER 00141092 24/32MM FEEDER 00141093 44MM
Technical Library | 2022-06-27 17:04:51.0
In today's Electronics Manufacturing Industry, standards for defect and quality control are stricter than ever due to advancements of electronic products and increasing safety and environmental regulations. Electronics Manufacturers are forced to maximize their production efficiency by implementing lean manufacturing initiatives and optimizing production processes. With this in mind, manufacturers are relying upon Automated Optical Inspection (AOI) equipment to streamline the manufacturing process and provide real time root cause analysis of manufacturing defects. The objective is to increase profitability by improving production yields and reducing costly rework.
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Career Center | Williamsport, Pennsylvania USA | Engineering,Quality Control
Corporate Director of Quality- Works on site in Williamsport, PA Reports to VP of Operations Summary The Quality Director is responsible for assuring the program health and operation of the overall quality management systems and the Quality A
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
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Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
Causes of PCB Warping & How to Prevent It | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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>> News Tombstoning -PCB Soldering Problems Tombstoning PCB Soldering Tombstoning -PCB Soldering Problems A type of open, known by a number of names
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