Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2017-10-05 05:56:21.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2021-11-22 06:40:32.0
Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.
Industry News | 2014-05-28 07:06:54.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the International Union of Materials Research Societies - International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.
Industry News | 2007-10-29 17:10:53.0
Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-03-14 19:45:10.0
Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will introduce RO-VARIO, a reflow oven with a new, flexible concept, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2023-08-07 10:18:06.0
Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.
