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Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

PICO is a modular pick and place system dedicated to tape and reel packaging of various components from tube, bulk (loose part) or in strip form.

PICO is a modular pick and place system dedicated to tape and reel packaging of various components from tube, bulk (loose part) or in strip form.

Videos

Modular automatic pick and place machine Featuring tape and reel module, bowl feeder and tube feeeder Ergonomic, easy access, economic and easy to use www.smt-equipment.com

AATEC Ltd

MPM 100 and Momentum BTB Printers

MPM 100 and Momentum BTB Printers

Videos

MPM 100 and Momentum BTB Printers

ITW EAE

Vitronics Soltec ZEVAm Selective Soldering System

Vitronics Soltec ZEVAm Selective Soldering System

Videos

ZEVAv selective soldering machine delivers the best value in the high-speed selective soldering market. The ZEVAv platform leverages proven, market-leading fluxing, preheating and soldering technology to meet the growing challenges of high yields, co

ITW EAE

ASM SIPLACE HS60 CHIP MOUNTER

Videos

Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50

Qinyi Electronics Co.,Ltd

ASM SIPLACE HS60 CHIP MOUNTER

Videos

Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50

Qinyi Electronics Co.,Ltd

ASM Siemens HS60/569-12028957

Videos

SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50mm to 368 x 4

Qinyi Electronics Co.,Ltd

Thermal paste dispensing by the DV-8000 on a D-583

Thermal paste dispensing by the DV-8000 on a D-583

Videos

Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.

The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.

Videos

The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.

ITW EAE

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