Industry News: characteristics (Page 1 of 53)

MIRTEC Receives GLOBAL Technology Award for MV-9 SiP HYBRID 3D AOI

Industry News | 2021-11-22 07:27:39.0

MIRTEC is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Inspection – AOI systems for its MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.

MIRTEC Corp

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

Northrop Grumman Enters Military Printed Circuit Board Market

Industry News | 2003-04-15 08:39:15.0

Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)

SMTnet

Matsushita Electric (Panasonic) Completes Switch to Lead-Free Solder Used for Printed Circuit Boards

Industry News | 2003-05-28 08:20:13.0

Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.

SMTnet

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

MIRTEC to Exhibit the Revolutionary APLHA 3D AOI System in the 3D AOI Arena, productronica 2019

Industry News | 2019-10-16 14:45:19.0

MIRTEC announces that the company will premier its all-new ALPHA 3D Automated Optical Inspection System at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four-day event scheduled to take place Nov. 12-15, 2019, at the Munich Trade Fair Center in Munich, Germany.

MIRTEC Corp

MIRTEC Receives Award for MV-9 SiP HYBRID 3D AOI Technology

Industry News | 2021-11-05 07:31:03.0

MIRTEC is pleased to announce that it received a 2021 Mexico Technology Award for its revolutionary MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

MIRTEC Corp

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Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software for SMT placement & AOI - Free Download.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

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