Electronics Forum | Fri Apr 07 12:35:14 EDT 2006 | Chunks
Hi Chim Chim, Hows Spritle these days? You guys still living in the trunk of the Mach 5? Tell Trixie, Mom , Pops, Sparky, Racer X ans Speed I said "Hi". BTW, The Shooting Star (#9) was way faster than your brother Speeds. All be it that it took
Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks
Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
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