Features & Benefits: One platform solution for any kind of production Commonality with existing equipment Linear motor drive increases reliability and reduces maintenance Wide component capability from 0402 (01005) chips to 90 x 100mm on up to 18" x
Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
Electronics Forum | Tue Jul 31 22:42:41 EDT 2001 | chip
In the past I have spoken to Multitronics sales reps and looked into the product line. I saw their equipment more suited for a smaller "mom and pop" type shop, I work for a mid size contract house and it wouldn't have come close to meeting my needs.
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Used SMT Equipment | SMT Equipment
Model:YV100 chip Pick and Place Machine Placement Speed:20000cph(0.18sec/CHIP Equivalent) Placement Range:0603(Metric base )to□31mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1650XW1408XH1425mm Weight:1580kg
Used SMT Equipment | SMT Equipment
Model :KE-1070 Pick and Place Machine Placement speed:Chips:18900CPH(0.190sec/chip) Component mount range:0603 chips ~33.5mm Station:80 Power supply:3-phase AC200~415C 3KVA Size:1500*1500*1455mm Weight:1590kg
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
Parts & Supplies | Pick and Place/Feeders
Valve and Ejector for Yamaha chip shooter Solenoid valve series KM1-M7163-20X A010E1-37W blow solenoid valve KM1-M7163-21X A010E1-54W Blowing Solenoid Valve KM1-M7163-30X A010E1-44W Vacuum Solenoid Valve KGA-M7111-H0X A041E1-48W 88X Vacuum Sole
Parts & Supplies | Chipshooters / Chip Mounters
508 pick and place nozzles for JUKI high-speed chip shooter KE-2010/2020/2030/2040 /2050/2060/FX-1 E35017210A0 NOZZLE ASM 101 E35027210A0 NOZZLE ASM 102 E35037210A0 NOZZLE ASM 103 E35047210A0 NOZZLE ASM 104 E35057210A0 NOZZLE ASM 105 E35067210
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Panasonic CM602 Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place m
ETA LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Pick and place machine, SMT pick and place machine, SMT mac
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | , New Jersey USA | Engineering
Several opportunities for skilled SMT Engineers and Product Support Engineers. Skilled in lean manufacturing and Kaizen. Skilled in working with BGA, Flip Chip and other related technologies. Skilled in new product introduction and line support acti
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0354-flip-chip
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes FLIP CHIP FLIP CHIP Flip Chip disbonded solder bumps and halo
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