ISO 9001: 2000 Franchised Distr. of Capacitors, Resistors, Semiconductors, SMD, Connectors, Crystals, Diodes, Fuses, ICs, Lamps, LEDs, Potentiometers, Relays, Switches, Transistors, Specializes in Hard to find/Obsolete Parts
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Application of WZ-1202 and WZ-1206 : thick film circuit, pressure sensor (piezoresistive type, capacitance type), glass glazed potentiometer, dielectric antenna, ceramic metallization, microwave oven magnetron RFID, automobile oil level sensor, air q
Electronics Forum | Thu Aug 21 08:15:07 EDT 2008 | naynayno
Thanks Dave, I will be sticking with Manufacturing Engineering. These are good guidelines but what is standard clearance for various packages? This is a dimension we usually seek by eye, whether we will have a problem or not. We use straight DI -
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Industry News | 2012-04-10 16:06:44.0
The iineo II pick-and-place equipment from Europlacer has doubled SMT production capacity for Detroit-based BGM Engineering.
Industry News | 2007-11-04 19:29:37.0
DORSET, UNITED KINGDOM - November 2, 2007 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display the Xpress 25 flexible high-volume SMT placement system in booth A4-125 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
SMT MACHINE GENUINE Juki Spare Parts JUKI 750 760 2020 2040 COUPLING E3023721000 SFC-010DA2 Pats Specifications: Brand Name JUKI 750 760 2020 2040 COUPLING Part number E3023721000 Model SFC-010DA2 Ensure Test in machine confirmation Guara
Technical Library | 2009-09-18 14:42:37.0
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
A technology that identifies the intermetallic compound formation, enables the system to provide closed loop feedback to the operator and validates the condition of the solder joint. This technology works in conjunction with SmartHeat® and patented C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
EMPF PP0005 - Mini-Ball Grid Array(mBGA) A Direct Chip Attach BGA (Oct 1994) Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home > Publications > Digital Downloads
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