Industry Directory | Manufacturer
PCB Assembly in Indonesia with ISO Certificate Are you looking for SMT and PCB Assembly ? We provide SMT and PCB Assembly service in Indonesia. Located at bonded zone West Java Indonesia. Suitable for export oriented market.
New Equipment | Test Equipment
Inspection system Application After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc. Program mode Manual programming, auto programming, CAD data importing
New Equipment | Test Equipment
Inspection system Application After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc. Program mode Manual programming, auto programming, CAD data importing
Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
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Parts & Supplies | Pick and Place/Feeders
Five uints laser control card for zevatech/juki 700 series available for sale. Shenzhen Green technology company is specialized in the field of cyberoptics laser sensor repair:juki laser,yamaha laser,sumsung laser, tenryu laser,philips laser etc,an
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Parts & Supplies | Pick and Place/Feeders
New and used IC THETA MOTOR,IC Z motor for juki 2060 available for sale. IC THETA MOTOR:PN:40003256,Model:TS4601N1620E600 IC Z MOTOR:PN:40003255,Model:TS4603N1320E601 www.greensmt.com SUPPLY & Repair JUKI MOTOR E96117210
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. If the cohesive force among metal powders in solder paste is smaller than the force created by the gasification, a small amount of solder paste will leave the soldering pad and some of them may hide under the chip components. When reflow soldering
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