Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. The increase in temperature has led to more damage, and more botched yields. According to Assembly Mag , for every 10-degree increase in temperature, the MSL rating degrades by one level
Surface Mount Technology Association (SMTA) | https://www.smta.org/LED/tech.cfm
., CALCE, University of Maryland 12:00 PM Lunch Session 3: LED Packaging 1:00 PM Solder Alloy Selection for LED Die Bonding and Package Assembly Nicholas Herrick, Alpha Assembly Solutions 1
