STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
New Equipment | Test Equipment
Semiconductor SMT Offline X-ray X-8000 Products Introduction | I.C.T Group www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner Semiconductor SMT Offline X-ray X-8000 Introduce: X-8000 electronic semiconductor testing equipment can
Electronics Forum | Wed Feb 06 07:02:31 EST 2019 | liquidspacie
We've found the problem. It was fault scale encoder. Swapping cards didn't help. Thanks everyone for the input.
Electronics Forum | Mon Jan 28 13:58:41 EST 2019 | oxygensmd
1. switch the axis cards 2. switch the axis servo cards 3. make sure the distance between scale and encoder is 400um 4. check the signal by oscilloscope, adjust to have the right signal 5. replace the scale or encoder
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Parts & Supplies | Chipshooters / Chip Mounters
Wanted working Power supply used on TIM 5100 machines. To be found on the lower left side of BEAM B. Its a multiblock power supply with 4 output slots. Slot 1 is 5VDC and Slot 2-4 is 24VDC. Looking for 1 or 2 of these. Please quote if you have such p
Parts & Supplies | Chipshooters / Chip Mounters
Wanted working Power supply used on TIM 5100 machines. To be found on the lower left side of BEAM B. Its a multiblock power supply with 4 output slots. Slot 1 is 5VDC and Slot 2-4 is 24VDC. Looking for 1 or 2 of these. Please quote if you have such p
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Technical Library | 2023-11-27 18:29:45.0
This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle for nearby interfacial cracks. Simplified two-layer periodic symmetry models were developed to investigate these interactions. Comparison of flip chip results using different solder material models showed that viscoplastic models yielded lower stress and fracture parameters than time independent elastic-plastic simulations. It was also found that adding second level attachment greatly increases the magnitude of the solder strain and fracture parameters. As expected, the viscoplastic and temperature dependent elastic-plastic results exhibited greater similarity to each other than results based solely on linear elastic properties. !DOI: 10.1115/1.1649242"
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
| https://www.eptac.com/error-404-not-found/
Error 404 - Not Found - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more? Visit
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/40046972-stopper-chip-152019?page=189&order=name+desc
.40046972 /shop/40046972-stopper-chip-152019 ¥ 0.00 0.0 CNY ¥ 0.00 ¥ 0.00 This combination does not exist. ADD TO CART Inquiry Now
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