Electronics Forum | Fri Mar 28 15:08:37 EDT 2008 | jmelson
Hello, all, I have been having problems with bent push rods on my Philips CSM84. I have caught it a couple times when it happened, but it happens so fast I still don't know exactly what the sequence is that causes this. The push rod is clipping a
Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell
Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell
Electronics Forum | Tue Mar 23 23:17:12 EDT 2021 | llawrence
Hello everyone, I work for a company that, up until now, has done everything using through-hole components. This has been fine for years, but we have been pushed into the world of surface mount manufacturing by a new product that is far cheaper and
Electronics Forum | Mon May 11 22:47:45 EDT 2009 | davef
We'd expect that a 0603 in properly cured, in-date code, properly dispensed chip bonder would take 5-8 pounds to push off the board.
Electronics Forum | Thu Mar 24 22:39:22 EST 2005 | pmd
My opertaors have lots of setup problems with vib feeders. They dont realize that the chip weight pushes parts down and when feeders run low it's the frequency that drives the parts. Mixing parts with diferant phisical deminsions and masses in the sa
Electronics Forum | Fri Jul 04 19:17:37 EDT 2014 | andrespena
Hi (I don't know if this forum is the best place to post something like this, but I don't know of other places on the internet, so... sorry if I'm in the wrong place) Might there be an easier way to add components (e.g. computer chips) to a circuit
Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Thu Oct 26 17:53:32 EDT 2000 | Dave F
John: I�m here. On "what do ya think about that one!..."??? Mutha, that sounds rat�s rump [as Dennis Miller says] ugly. On some boards, we paste a cuppla chips on the break-away panels and then torque the chips from the board after cure. We use the
