Industry Directory: chip strength (5)

Nepes Corporation

Nepes Corporation

Industry Directory | Component Packaging

Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.

New SMT Equipment: chip strength (140)

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

ETA Online Jet Dispensing Machine D400

ETA Online Jet Dispensing Machine D400

New Equipment | Dispensing

ETA Online Jet Dispensing Machine D400​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Dispensing Machine,SMT Glue Dispensing Machine,Dispe

Shenzhen ETA Technology Co., Ltd

Electronics Forum: chip strength (46)

Re: Adhesive strength specs

Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis

As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold

Component soldering strength ?

Electronics Forum | Mon Jul 30 21:29:34 EDT 2001 | kennyhktan

Hello Michael & All, Thanks for the feedback. Months ago we receive a number of reject concerning one of the 0805 & 0603 chip capacitor mising (with joint remain on pad)and seriously solder joint fracture. From there I had do some investigation

Industry News: chip strength (89)

Pillar Flip Chip Applications at SEMICON West

Industry News | 2016-06-22 16:15:35.0

KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.

KYZEN Corporation

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Parts & Supplies: chip strength (2)

Fuji Fuji rotating head 2UGGHB0004** XPF rotating head new nine claws original brand new

Fuji Fuji rotating head 2UGGHB0004** XPF rotating head new nine claws original brand new

Parts & Supplies | Assembly Accessories

Fuji rotating head 2UGGHB0004** XPF rotating head new nine claws original brand new Fuji rotating head 2UGGHB0004** XPF rotating head new nine claws original brand new Mandy CNSMT Electronics Equipment Co.LTD Email:info@smtlinemachine.com &n

CNSMT CO.LTD

Fuji fuji xp143e chip shooter

Fuji fuji xp143e chip shooter

Parts & Supplies | SMT Equipment

contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 XP ball spline: XP141E Z-axis ball spline:DEPH1031 XP243/XP143/XPF的X all spline:DNSX1010 XP243 Y-axis ball spline:GFSY3311 XP243 bearing for Y-axis ball spline:H4217T XP142/XP14

ZK Electronic Technology Co.,Limited

Technical Library: chip strength (129)

Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

Metcal

Attaching Fiber Optic Modules

Technical Library | 2019-08-01 10:58:32.0

Optical fibers transmit information in the form of pulses of light. The advantages of optical fibers over traditional copper wires include: higher throughput, greater signal distance and speed, smaller cable mass and diameter, greater pull tension limit, and resistance to electromagnetic interference (EMI) and radio frequency interference(RFI). The disadvantages of fiber optics when compared to copper wires include: end-face defects, cleanliness, and the ease of attaching connectors to electronics assemblies (Figure 1).

ACI Technologies, Inc.

Videos: chip strength (3)

YINCAE SMT 266 Jetting Application Process

YINCAE SMT 266 Jetting Application Process

Videos

http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process

YINCAE Advanced Materials, LLC.

SN100C P810 D4 low-voiding lead-free solder paste.

SN100C P810 D4 low-voiding lead-free solder paste.

Videos

SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/

Nihon Superior Co., Ltd.

Career Center - Resumes: chip strength (13)

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: chip strength (380)

Partner Websites: chip strength (81)

Milprobes for BGA, SMT, Through Hole

Beau Tech | https://www.beautech.com/bt_milprobes.pdf

! Available MilProbe Sizes: • 1 MilProbes • 10 MilProbes • 25 MilProbes Features: • 1 MilProbes are made of a special, high tech alloy to provide the necessary strength

Beau Tech

News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news/0/0.chtml

Technical Home - News News News Trade Info Company News SMT Technical How to operate the safety interlock of Hanwha Chip Mounter correctly


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