New SMT Equipment: class%' and '8%'='3 (428)

PAC-VAC Vacuum Tweezer System For Wafers and Substrates

PAC-VAC Vacuum Tweezer System For Wafers and Substrates

New Equipment | Hand Assembly

PAC-VAC® vacuum tool kit, battery operated. The PAC-VAC® is battery operated and self-contained, runs up to eight hours continuously on one 9 volt alkaline battery. This versatile unit can be clipped to your belt or pocket for one-handed portable ope

Virtual Industries, Inc.

CM602 Pick and Place Machine

CM602 Pick and Place Machine

New Equipment | Pick & Place

Features & Benefits: One platform solution for any kind of production Commonality with existing equipment Linear motor drive increases reliability and reduces maintenance Wide component capability from 0402 (01005) chips to 90 x 100mm on up to 18" x

KingFei SMT Tech

Electronics Forum: class%' and '8%'='3 (87)

SMT Processing and gasketing

Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef

SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E

BGA assembly and inspection

Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes

60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept

Used SMT Equipment: class%' and '8%'='3 (1)

Exfo FTB-500 Platform and FLS-5834A CD/PMD Analyzer Source

Exfo FTB-500 Platform and FLS-5834A CD/PMD Analyzer Source

Used SMT Equipment | General Purpose Test & Measurement

We ship worldwide. Please feel free to contact us if you need further information. EXFO FTB-500 Platform and FLS-5834A CD/PMD Analyzer Source Connects anywhere: USB, 3G, Wi-Fi, VPN and Bluetooth Loaded with utilities: all the tools required to

Shenzhen Zhongce Photoelectric Technology Co., LTD

Industry News: class%' and '8%'='3 (464)

Tech Systems to Represent Europlacer in SoCal and Baja Territories

Industry News | 2014-09-04 18:37:21.0

Europlacer announces that it has appointed TechSystems LLC, as its manufacturers’ representative throughout Southern CA, Nevada and Baja Mexico.

EUROPLACER

Europlacer to Demonstrate XPii-II SMT Pick-and-Place Machine and Speedprint to Demonstrate SP700avi SMT Stencil Printer at IPC Midwest Conference

Industry News | 2011-08-22 19:55:04.0

Europlacer will demonstrate its XPii-II pick-and-place machine along with Speedprint’s SP700avi 29” Inline Stencil Printer in booth 309 at IPC Midwest

EUROPLACER

Parts & Supplies: class%' and '8%'='3 (7)

Fuji Smt Fuji NXT H04S nozzles 1.8 3.7 nozzle used in pick and place machine

Fuji Smt Fuji NXT H04S nozzles 1.8 3.7 nozzle used in pick and place machine

Parts & Supplies | Pick and Place/Feeders

Smt Fuji NXT H04S nozzles 1.8 3.7 nozzle used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Noz

KingFei SMT Tech

Fuji Smt Fuji NXT H04S nozzles 1.8 3.7 nozzle used in pick and place machine

Fuji Smt Fuji NXT H04S nozzles 1.8 3.7 nozzle used in pick and place machine

Parts & Supplies | Pick and Place/Feeders

Smt Fuji NXT H04S nozzles 1.8 3.7 nozzle used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Noz

KingFei SMT Tech

Technical Library: class%' and '8%'='3 (63)

Risk Mitigation in Hand Soldering

Technical Library | 2019-01-02 21:51:49.0

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.

Metcal

Hand Printing using Nanocoated and other High End Stencil Materials

Technical Library | 2019-05-29 23:10:30.0

There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.

BEST Inc.

Videos: class%' and '8%'='3 (119)

Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150'000 dots per hour, dispenses 3D patterns and much more. -Small footprint of only 1sqm -Easily adaptive for your application -Up to 2 dispensing valves -Free cho

Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150'000 dots per hour, dispenses 3D patterns and much more. -Small footprint of only 1sqm -Easily adaptive for your application -Up to 2 dispensing valves -Free cho

Videos

http://www.my-smt-spider.com/ Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150'000 dots per hour, dispenses 3D patterns and much more. -Small footprint of only 1sqm -Easily adaptive for your ap

ESSEMTEC AG

Training Courses: class%' and '8%'='3 (13)

Profiling and Solder Reflow Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Failure Analysis and Reliability Testing in Electronics Manufacturing

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: class%' and '8%'='3 (9)

PCB Inspection Training and Certification

Events Calendar | Mon Sep 12 07:30:00 EDT 2016 - Mon Sep 12 16:00:00 EDT 2016 | Rolling Meadows, Illinois USA

PCB Inspection Training and Certification

BEST Inc.

BGA Rework Training and Certification

Events Calendar | Wed Sep 28 00:00:00 EDT 2016 - Thu Sep 29 00:00:00 EDT 2016 | Rolling Meadows, Illinois USA

BGA Rework Training and Certification

BEST Inc.

Career Center - Resumes: class%' and '8%'='3 (1)

An Experienced Project Manager and Product Manager

Career Center | Toronto, Ontario Canada | Engineering,Production,Purchasing,Sales/Marketing

A dedicated professional with 17+ years of experience in product management, marketing, project management, engineering and manufacturing. Demonstrated ability to interact with customers and manage cross-functional teams to drive business growth. 4+

Express Newsletter: class%' and '8%'='3 (138)

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Embedded passives

SMTnet Express - July 28, 2016

SMTnet Express, July 28, 2016, Subscribers: 25,879, Companies: 14,883, Users: 40,795 Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware Mike Bixenman, DBA - Kyzen Corporation

Partner Websites: class%' and '8%'='3 (26282)

Tempered Leads, Class 3 Rework, Toe Fillets and More - EPTAC

| https://www.eptac.com/webinar/tempered-leads-class-3-rework-toe-fillets-and-more/

Tempered Leads, Class 3 Rework, Toe Fillets and More EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes

7600 - ADAPTER, 3/8 NPTF X 3/8 BSPTM

Heller Industries Inc. | https://hellerindustries.com/parts/7600/

7600 - ADAPTER, 3/8 NPTF X 3/8 BSPTM Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.


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