Industry Directory | Manufacturer
An electronics assembly services co. Specializes in assembly upto IPC-A-610, Class 2. Very competitive pricing structure and and very quick turn. Commercial CCA, cable, SMT, thru-hole, rework.
Industry Directory | Manufacturer
Headquartered in Sacramento, Fast Circuits Inc. provides PCB fabrication and assembly services. Since 2009, it has manufactured PCBs in low to middle volumes, as well as flexible or rigid PCB prototypes.
Orion provides flexible, polyurethane filter foam to remove dust and contaminating particles from the air, gases and liquids in a variety of applications. The open pore skeletal structure provides low air resistance ideal for use in computers, electr
Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Electronics Forum | Mon Apr 13 18:18:31 EDT 2020 | wbrenner
Does any one have a general cost percent going from class 2 to class 3 for the same Assembly.. Or, general up charge percent when biding class 2 vs class 3?
Electronics Forum | Thu Aug 07 22:51:05 EDT 2008 | davef
We expect aerospace to be IPC-A-610, Class 3 and J-STD-001, Class 3. The above quality statement stecifies: * "IPC 610, Class 2 acceptability." This is unclear. Should this be "IPC-A-610, Class 2 acceptability?" * No class for J-STD-001. Should we a
Industry News | 2016-09-29 20:17:32.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2008-09-21 01:46:38.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Sarasota, Florida | Production
Operation of SMT equipment including Screenprinters, Chipshooters, Component Mounters, Reflow Ovens, etc. Set-up new jobs. Inspection to IPC-A-610 Class 2. Competitive wages and excellent benefit package. Qualified candidates may apply via email
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
