Since 1986, our focus on delivering quality PCB's and Assemblies hasn't changed. Our top priority has always been to understand what the customer values, evaluate their needs and deliver the best-in-class service and products.
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
863 exhibits excellent wettability, extended stencil life, superior hot slump, and low voiding. Flux class ROL0. Exceeds J-Std-006. 863 provides excellent print definition. Good release is seen on 12-9 mil apertures with print speed of 1.0-6.0 inch p
Electronics Forum | Tue May 05 08:18:28 EDT 1998 | Jon Medernach
Good luck, I would advise you to contact the National Training Center for Microelectronics in Bethlehem, PA. They have actual courses in all aspects of SMT assembly and they are reasonable. As far as equipment for startup, I would look for used if
AGILENT, X Ray inspection machine, In line, type 5300-5DX-SERIES 3, SN: US40690565, double top opening, laser class 1, laser subsystem class 3B, equipped with double PC inside, monitor control AGILENT, included small table with standard monitor and k
FlexLink F5000H-K Ultra-Compact Laser Cell. This item is USED. Item is sold as pictured. The Laser Cell can mark on all types of non-metallic surfaces including ceramics, glass and plastics. Standard features (from Manufacturer’s websit
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
Detailed Product Description Brand: Cyberoptics Part Name: Laser Sensor Model: 6604098 Condition: Original Used Application: Yamaha YVL88 Warranty: 3 Months Yamaha YVL88 YV88II CyberOptics Laser 6604098 Class I Laser Products Used Description
SMT Cleanroom Microfibre Wiper paper Applications: Superior for spill control and general wiping in Class10~1,000 environments; Cleaning and polishing the products TFT-LCD, Optical and other critical industries etc.request; Maintaining critica
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
The i4.0 Connect Forum will return this October (2nd & 3rd) to the heart of Silicon Valley for our second US Industry 4.0 event. Our 2 day event will explore the Industry 4.0 eco system. Join our world class speakers, exhibitors and customers as
For Sale: Used ERSA VersaFlow 40/50 dual module selective soldering machine. Best in class for speed, flexibility, and reliability. Available for live or video demonstration at the Capital Equipment Exchange. details at... http://www.ce-exchange.c
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Thu Jul 26 00:00:00 EDT 2018 - Thu Jul 26 00:00:00 EDT 2018 | ,
Cleaning for Reliability - Overcoming Challenges for Class III Assemblies - Online Webinar
Career Center | Delhi, India | Engineering,Production,Quality Control
Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs
SMTnet Express, July 28, 2016, Subscribers: 25,879, Companies: 14,883, Users: 40,795 Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware Mike Bixenman, DBA - Kyzen Corporation
Hand Soldering Training Classes – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
), Standards Experts (CSE) and Operators (CIS). JAN FEB MAR APR MAY JUN JUL AUG SEP OCT NOV DEC JAN Classes held in Longmont, CO: IPC-A-610 Jan. 3 – 6 IPC 7711/7721 Jan