Industry Directory: clean room operation cost (35)

CRAC, spol. s r.o.

CRAC, spol. s r.o.

Industry Directory | Design / Turnkey / Consultant / Service Provider

Company CRAC is designer and supplier of technological units - Clean Rooms, operating rooms, specialized laboratories, production facilities and HVAC systems. CRAC operate in Czech Republic and in central Europe.

Stadium Asia Ltd.

Stadium Asia Ltd.

Industry Directory | Contract Manufacturer

ISO 13485 approvals for the manufacture of medical devices. Factory location at Dongguan, China. Reliable company that the group of company has 100 years history. IP protection of customer product

New SMT Equipment: clean room operation cost (1178)

Vertical Curing Mini Oven - Heller 755

Vertical Curing Mini Oven - Heller 755

New Equipment | Curing Equipment

The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod

Heller Industries Inc.

Vertical Curing Oven - Heller 788

Vertical Curing Oven - Heller 788

New Equipment | Curing Equipment

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Electronics Forum: clean room operation cost (164)

clean rooms/ wire bonding

Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI

It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w

Cleanning no clean residu

Electronics Forum | Fri Oct 19 13:57:17 EDT 2007 | Michael Konrad

Hi Rob, I must take issue with your statement �By definition, no clean solder can be not-cleaned�. All no-clean fluxes can be cleaned. Whether or not one cleans no-clean depends on a variety of factors. More than eighty percent of all post reflow

Used SMT Equipment: clean room operation cost (15)

Camalot Xyflexpro+

Camalot Xyflexpro+

Used SMT Equipment | Adhesive Dispensers

Camalot Xyflexpro+ For Sale Machine is in excellent running condition coming out of clean room environment See attached pictures and information below Camalot Xyflexpro+ Model: 7200 Year 2007 620 Pump Weight Scale Height Sensor Left to

1st Place Machinery Inc.

SPEA 4020M Flying Probe

SPEA 4020M Flying Probe

Used SMT Equipment | In-Circuit Testers

Notes:  This system has been kept in a clean room lab.  Usage is extremely low, as it was for demo purposes only. Details:                               *        4020 M; High Speed; Manual Loading; 4 Probes; *         Internal Graphic printer; 24

Lewis & Clark

Industry News: clean room operation cost (716)

Virtual Industries Debuts PORTA-VAC� II Kit With Molded Peek� Wafer Tip

Industry News | 2009-06-08 23:31:02.0

COLORADO SPRINGS, CO � June 2009 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces the availability of the PORTA-VAC II with wafer tip VMWT-C, capable of handling up to 8" (200 mm) wafers.

Virtual Industries, Inc.

Virtual Industries Introduces New BULB-VAC Tool

Industry News | 2009-03-06 15:42:30.0

COLORADO SPRINGS, CO � March 2009 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces the premier of the cost-effective BULB-VAC tool, part number BVJ-075-B.

Virtual Industries, Inc.

Parts & Supplies: clean room operation cost (3)

SMTmax AE-R330A

SMTmax AE-R330A

Parts & Supplies | Soldering - Reflow

This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of

SMTmax

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Technical Library: clean room operation cost (278)

Placement Optimisation in a Lean Manufacturing Environment

Technical Library | 2008-02-20 21:42:52.0

Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.

EUROPLACER

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: clean room operation cost (51)

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries.

Videos

The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod

Heller Industries Inc.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Career Center - Resumes: clean room operation cost (25)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Production Supervisor

Career Center | DALLAS, Texas USA | Production

Extensive, diverse background in Production Management and Warehousing in state of the art manufacturing environments.  Exceptional ability to translate corporate strategies and orchestrate between business components, resulting in deliverables on ti

Express Newsletter: clean room operation cost (923)

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market Online Version SMTnet Express, October 13, 2016, Subscribers: 26,523, Companies: 14

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Using Hansen Space

Partner Websites: clean room operation cost (656)

Nordson Corporation News Room - All News Releases

Nordson ASYMTEK | https://www.nordson.com/en/our-company/news-room/news-releases?qs=t&page=22

Valve from Nordson EFD is Next Generation Dispensing Technology 2018-04-03 - Nordson EFD 60% smaller, modular needle valve with Quick Release clasp is easy to clean and maintain in under 2 minutes – reducing downtime while boosting productivity Cost

Nordson ASYMTEK

Boat Unloader-Trade Info-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_news,26371&url=_print

) OPTIONS Cover design SUS device for clean room(Non-painting) Customized   LED Bulb Assembling Line And Assembling Tools , Line Assembling LED , Manual Solder Printer , Reflow Oven Small , Lead-Free Wave Soldering Machine , SMT


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vision placer pnp creator

PCB Assembly Supplies - ONLINE STORE
SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
Online IPC Training & Certification

Software for SMT placement & AOI - Free Download.
fluid dispensing pumps for integration

ONLINE IPC Training & Certification