Industry Directory | Manufacturer
2Layers - 18Layers ;HASL, OSP, Gold plating, immersion Gold/Silver/Tin, removable mask, gold-finger, carbon ink;Conact Person:Rene E-mail:rene@speedingcircuit.com Website:www.speedingcircuit.com
Industry Directory | Manufacturer
We serve the Electronics and Clean room industry with our finger cots. Our superior quality meets the requirements needed to provide protection, durability, and comfort for the user.
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Wave Soldering
PCB wave soldering machine HR-300E: 1. PLC and touchscreen controlling system which can save more than 50 sets parameters. User-frienly interface is easy to be operated,temperature can be set/saved/modified in touchscreen. 2.The high quality spraye
Electronics Forum | Tue Jul 18 10:16:49 EDT 2006 | russ
Clean up!, check all conveyors for paste, the printer, oven. If you are splattering in the oven than you need a better profile or better paste, one of the two, maybe both. Hope was helpful Russ
Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat
Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi
Used SMT Equipment | Soldering - Wave
This machine will be coming available for purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version V4.6
Used SMT Equipment | Soldering - Wave
Speedline Electrovert Vectra 450/F Wave Soldering Machine Make: Speedline Electrovert Model: 450/F Year: 1999 Lead-Free Convection Bottom-Side Preheat (2 Zones) No-Clean Flux Board Grip & L Fingers SW: V3.27 Complete & Operational
Industry News | 2019-03-14 11:28:14.0
Precision PCB Services, Inc. Opens New Texas Location
Industry News | 2010-12-03 21:35:04.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Parts & Supplies | Assembly Accessories
FINGER 47152202 Finger For Tolo 21-0001-001 Suneast finger V type A62045CT Finger Cleaning Brush 21-0001-005 Finger Valve VHK3-12F-12F Right Finger Brush For JT MPS-350 Wave Oven FINGER VALVE P
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Parts & Supplies | Assembly Accessories
Right Finger Brush For JT MPS-350 Wave Oven Brushless DC Motor Driver(24 VDC) BLHD30K BRUSH, FEEDER KV7-M8820-20 DC Brushless Motor ES90/ES100 Stainless Steel Brush For JT MPS-350 Finger Left Fing
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
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Career Center | Reading, Pennsylvania USA | Production,Technical Support
Job Title: Surface Mount Technology Operator Department: Production Department Reports To: Production Manager FLSA Status: Non-Exempt Summary: Responsible for monitoring, maintaining, and adjusting equipment used to create electronic circuits w
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/applications/cleaning?con=t&page=9
Plasma Cleaning | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series XTRAK System RIE System PD Plasma Deposition Series PROGENY System PCB Systems VIA High
Lewis & Clark | http://www.lewis-clark.com/product-tag/gold/
Gold Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
