Industry Directory | Consultant / Service Provider / Manufacturer / Training Provider
The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.
Industry Directory | Manufacturer of Assembly Material / Assembly / Cleaning / Contract Manufacturer
We are offering EMS services,& We are one of the leading suppliers of soldering materials like Solder Sticks/Bars Pastes, IPA,& Soldering Fluxes,& Buyers of solder dross, cut leads and waste chemicals
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Electronics Forum | Wed Jul 21 17:49:52 EDT 2004 | jsk
problem: Too many solvents and boards are not clean Flux remains on the board after vapor degreaser and "Powdery" white residue after vapor degreasing Flux type is kester 186 Process: hand solder High Temp alloy, spot clean after hand solder e
Electronics Forum | Wed Aug 10 08:53:45 EDT 2005 | jh0n!
Wasn't aware of that. We're using a no-clean with RF pcbs, and that's something to bear in mind for the future - thanks.
Used SMT Equipment | Soldering - Selective
This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version
Used SMT Equipment | Soldering - Reflow
Heller 1800EXL Reflow Oven Features: * Computer-controlled automatic lubrication system for "hands-off" maintenance * Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" mainten
Industry News | 2013-02-13 20:01:59.0
ZESTRON, is pleased to announce that ZESTRON America’s accredited application engineers will be presenting at the IPC APEX 2013.
Industry News | 2006-03-06 12:12:12.0
ZESTRON will be exhibiting at Electronica & Productronica China on March 21st - 23rd, 2006.
Parts & Supplies | Assembly Accessories
SMT MACHINE SPARE PARTS JUKI MTS X Y STEPPING MOTOR DRIVER 40045711 FS1W075P24 Specifications: Brand Name JUKI MTS X Y STEPPING MOTOR DRIVER 40045711 FS1W075P24 Part number 40045711 Model FS1W075P24 Ensure Test in machine confirmation Gua
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Parts & Supplies | Assembly Accessories
Right Finger Brush For JT MPS-350 Wave Oven Brushless DC Motor Driver(24 VDC) BLHD30K BRUSH, FEEDER KV7-M8820-20 DC Brushless Motor ES90/ES100 Stainless Steel Brush For JT MPS-350 Finger Left Fing
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2009-12-22 21:47:08.0
While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ONLINE | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Sep 27 00:00:00 EDT 2018 - Thu Sep 27 00:00:00 EDT 2018 | ,
LED Cleaning and Reliability - Online Webinar
Events Calendar | Thu May 28 00:00:00 EDT 2020 - Thu May 28 00:00:00 EDT 2020 | ,
Cleaning with pH Neutral Chemistry - Background, Applications, and Benefits
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world
SMTnet Express April 11, 2013, Subscribers: 26336, Members: Companies: 13353, Users: 34557 No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability by: Todd L Kolmodin, VP Quality; Indium Corporation of America No-clean
ITW EAE | https://www.itweae.com/applications/electronic-assembly-materials/no-clean
dispensed products such as adhesives. Applications Printing Dispensing Cleaning Wave Soldering Reflow Soldering Selective Soldering Electronic Assembly Materials Adhesives Flux Lead-Free No Clean Solder Solder Paste Solvents Water Based
| https://store.aciusa.org/EMPF-PP0015-Low-And-No-VOC-Conformal-Coatings-Over-No-Clean-Flux-Residues-Aug-1995--P99.aspx
EMPF PP0015 - Low-And No-VOC Conformal Coatings Over No-Clean Flux Residues (Aug 1995) Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home > Publications > Digital Downloads
