Industry Directory | Cleaning / Test Services / Training Provider
The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.
Industry Directory | Component Preparation / Inspection / Repair / Rework
A leading supplier of manual vacuum handling solutions to the worlds high technology firms.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Electronics Forum | Tue Oct 29 08:41:48 EST 2002 | peterpaulmary
from my experience, no clean mean "difficult and cannot clean" Normally, you will observe white residue when cleaning it. You should study the flux in the no-clean solder cream before cleaning it. Or change no clean solder to clean type solder
Electronics Forum | Thu Mar 20 16:34:15 EDT 2008 | guhansub
You need to use speial cleaning solution to clean the residues from no clean pastes. Alpha has a solution,(I think Alpha 2010)that can clean no-clean residues. Zestron is another company which specializes in cleaning no clean residues. contact Alpha
Used SMT Equipment | Repair/Rework
Includes: manual, software, cpu, footswitch, monitor, key board, and mouse Options: * Site Cleaning System * Pivoting IR Probe
Used SMT Equipment | Soldering - Reflow
Please go to Web site link for details and pictures. Unit is very clean as it was PM'd every 30 days. Inside looks like new. Very well optioned: Left to right Edge with center rail support N2 with water cooling (chiller available)
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Parts & Supplies | SMT Equipment
DEK Cleanroom cleans paper,Smt steel net wipes paper,Printer steel net wipes paper Description: Brand name:DEK Cleanroom cleans paper Paper size:300㎜×10m Paper tube:φ20㎜×530㎜ Material:Fiber wood pulp Applitation:MPM,DEK,KME,YAMAHA,MINAMI,JUKI,
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Aug 30 00:00:00 EDT 2018 - Thu Aug 30 00:00:00 EDT 2018 | ,
Stencil, Underside Wipe and Misprint Cleaning - Online Webinar
Events Calendar | Thu Jun 18 00:00:00 EDT 2020 - Thu Jun 18 00:00:00 EDT 2020 | ,
Jet Printing Solder Paste and Cleaning Challenges
Career Center | zurich, Switzerland | Accounting/Finance,Production,Sales/Marketing,Technical Support
We provide all the materials (including but not limited to Machine, Chemicals, Salts, and Powders) for cleaning anti breeze, defaced banknotes. The machine for processing huge amounts can be made available on customer's demand. Email: sandersarah30
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
SMTnet Express, August 4, 2016, Subscribers: 25,952, Companies: 14,893, Users: 40,834 Evaluation of Under-Stencil Cleaning Papers Lars Bruno; Ericsson AB Solder paste screen printing is known to be one of the most difficult processes to quality
| https://kyzen.com/cleaning-chemistries/aquanox/aquanox-a4651us/
. AQUANOX A4651US cleans most lead-free, no-clean, rosin-based, and water-soluble flux residues consistently on assemblies. AQUANOX A4651US provides bright and shiny solder joints with no sump side additives and cleans exceptionally well on the latest flux formulations
