ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Product Name: solder paste rewarming machine Origin: Shenzhen Material: hot steel spraying Product size: L500 * w300 * h230 (mm) Weight: net weight 15kg, plus packing weight 20kg
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Tue Sep 11 11:22:34 EDT 2018 | sarason
To answer your question directly Boardwidth - X = newX for a flipped board. Plus adjustments for your offset if your board is not perfectly symetrical You can try my program PCBSynergy which generates many formats from CAD files, or PCBCSV files. If
Electronics Forum | Thu May 27 22:29:14 EDT 1999 | Mike Flori
Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to s
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2008-03-04 12:05:25.0
APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.
Industry News | 2008-09-14 15:09:42.0
APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
MP IV LAUNCH PLUS a leading environmental profile. Aquatic toxicity LC 50 (Rainbow trout, 96 h OECD 203) 2.4 g/L EC 50 (Ceriodaphnia spec., 48 h OECD 202) 0.5 g/L EC 50 (Bacteria, 30 min DIN EN ISO 11348-2
(Technical Information 3) prior to cleaning plastics. TE C H N IC A L IN FO RM A TI O N 1 TI1-ZESTRON FA PLUS-US ITAR registered to comply with the U.S