Electronics Forum: close openings on the stencils (7)

Aligning camera on the MPM AP25

Electronics Forum | Sun Sep 25 20:20:22 EDT 2011 | johnyq

We recently aquired an old MPM-AP25 stencil printer that printed paste with a large error (about .060 inches). I concluded camera alignment to be the cause but was surprised by the magnitude. I found the camera beam splitter prism misaligned and loos

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 15:13:29 EDT 2014 | emeto

Thank you guys. As we are speaking I keep examine the problem and here is what I got so far. 1. I measured the temperatures on my profile and the lead is hotter than the board. The lead goes 12 seconds earlier than the pad and is taking the solder.

Industry News: close openings on the stencils (7)

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Technical Library: close openings on the stencils (16)

Effect of Cu–Sn intermetallic Compound Reactions on the Kirkendall Void Growth Characteristics in Cu/Sn/Cu Microbumps

Technical Library | 2014-07-02 16:46:09.0

Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems

Nepes Corporation

The Surface Finish Effect on the Creep Corrosion in PCB

Technical Library | 2012-05-10 19:48:10.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In thi

Integrated Service Technology (IST)

Express Newsletter: close openings on the stencils (756)

SMTnet Express - November 5, 2015

SMTnet Express, November 5, 2015, Subscribers: 23,715, Members: Companies: 14,740, Users: 39,288 Print Performance Studies Comparing Electroform and Laser-Cut Stencils Rachel Miller Short, William E. Coleman Ph.D.; Photo Stencil LLC

Partner Websites: close openings on the stencils (26)


| https://www.clariant.com/en/Careers

& Businesses Sustainability Company Media Investors Careers Close Home / Careers Home JOIN US ON OUR JOURNEY SHAPE THE FUTURE Play x SEARCH AND APPLY We are Clariant At Clariant we are pushing

Hot Melt Applicators: Electric Adhesive Guns & Hot Melt Valves - Nordson Adhesive Dispensing Systems

Nordson ASYMTEK | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/additional-filter-product-subtype/electric-applicators?con=t&page=3

Hot Melt Dispensing Guns Adhesive Dispensing Systems Features EasyOn™ module mounting and provides up to twice the service life of other guns, reducing module replacement costs. Universal™


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The Branford Group
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A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.

Equipment Dealer / Broker / Pick and Place

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Phone: 203-488-7020

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