Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
Industry News | 2019-06-20 06:07:16.0
Yesterday we ship 1*20GP container to our Asian distributor for BGA rework station and COF bonding machine. This is the 2nd container in 30 days for our Asian customers.
Industry News | 2013-11-08 18:07:48.0
Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
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