PCB Testing PCB circuit Quality Insepction Machine AOI T11 Scanning：face/hour 200 face 180face 160face 120face Test method based on size：18″×24″ 5mil 4mil 3mil 2mil Demension:2150mm×1350mm×1780mm Weight:1500KG Pr
PCB Testing PCB circuit Quality Insepction Machine AOI T11 Scanning：face/hour 200 face 180face 160face 120face Test method based on size：18″×24″ 5mil 4mil 3mil 2mil Demension:2150mm×1350mm×1780mm Weight:1500KG Pro
Electronics Forum | Thu Feb 08 09:41:23 EST 2007 | SWAG
Check the bare board - could also be an unmasked via on the heel of the pad that is sucking solder into it.
Electronics Forum | Thu Feb 08 08:54:56 EST 2007 | jhaviland
groundplane not heating properly.. Is it a J leaded IC? sometimes these get bent slightly in the packaging and sit just far enough off the board to cause solder problems.
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
Heller Industries Inc. | https://hellerindustries.com/parts/800531/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=7
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Cold Bump Pull Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or
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