Industry Directory | Consultant / Service Provider / Standards Setting / Certification / Training Provider
ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.
New Equipment | Test Equipment
Online AOI Machine S810 Inspection Component: 01005 chip PCB size::50×70mm-510×460mm Dimension:1000mm×960mm×1600mm Weight: 710kg Product description: Online AOI Machine S810, Inspection Component: 01005 chip, PCB size:
New Equipment | Test Equipment
Online AOI Machine S810 Inspection Component: 01005 chip PCB size::50×70mm-510×460mm Dimension:1000mm×960mm×1600mm Weight: 710kg Product description: Online AOI Machine S810, Inspection Component: 01005 chip, PCB size
Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier
Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2011-02-24 20:35:03.0
The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Santa Clara, California USA | Maintenance
Coordinator and/or perform preventive maintenance/programming on SMT equipment. Troubleshooting, data analysis, root cause analysis, train SMT machine operators, follow and improve manufacturing processes. Must be familiar with DEK265 Printer, Fuji C
Career Center | Danville, Illinois USA | Production
http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
SMTnet Express, July 19, 2018, Subscribers: 31,194, Companies: 10,991, Users: 24,953 Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith; FCT ASSEMBLY, INC. Reduction of first pass defects in the SMT assembly process
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unfortunately, there are numerous causes that can produce solder bridging. To produce as quickly and efficiently as possible, finding the root cause of this defect is critical
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
