15W UV Laser Economic PCB Laser Depaneling System PCB Laser Depaneling System Specification: Laser solid-state UV laser Laser Wavelength 355nm Laser Source UV 15W@30KHz Positioning Precision ±2μm
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Used SMT Equipment | Pick and Place/Feeders
Dear Customer, We have the machine as below for sales, Model: KE 2070 L Vintage: 2010 No Feeder Please contact us if you are interested. Regards Michael var LEO_HIGHLIGHTS_INFINITE_
Used SMT Equipment | Pick and Place/Feeders
Dear Customer, We have the following machine for sales, Model: KE 2080 L Vintage: 2010 No Feeder C/W Tray unit Please contact us if you are interested. Regards Michael var LEO
Industry News | 2002-03-29 07:49:10.0
A Corporate Workforce Reduction of 25%
Industry News | 2020-05-28 10:52:31.0
SFI High Attenuation Frameless Enclosures are compact, easy to setup and tear down, and offer excellent EMI isolation on the benchtop
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
15W UV Laser Economic PCB Laser Depaneling System PCB Laser Depaneling System Specification: Laser solid-state UV laser Laser Wavelength 355nm Laser Source UV 15W@30KHz Positioning Precision ±2μm
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
. The NSMD BGA pad stack is necessary for the Ball to fully collapse around the pad edge securing it to the PCB - The SMD (Solder Mask Defined) BGA pad stack prevents the Ball Collapse
