Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Soldering is now lead-free. Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface t
Electronics Forum | Wed Apr 14 10:58:12 EDT 2004 | heatherc
Aegis software offers an MES system that offers both automated and manual data collection points. All of the data collected is automatically deposited in one central database. This database is then used for generating all of the SPC reports for ana
Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):
ASC International Laser Vision SP3D-ADC 3D Solder Paste Inspection. This item is USED but should work as intended. This item came from a working environment. THIS ITEM COMES WITH WHAT YOU SEE IN THE PICTURES IF YOU DON’T SEE IT, YOU PROBABLY
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2019-10-25 14:18:47.0
MIRTEC announces that it was awarded a 2019 Mexico Technology Award in the category of Software – Production for its Revolutionary Total Remote Management System (TRMS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. MIRTEC has collaborated with Cogiscan on a fully integrated Industry 4.0 Solution that displays data collected from MIRTEC’s award-winning AOI and SPI systems as well as all other equipment in the SMT manufacturing line.
JUKI IC COLLECTING BELT FEEDER RB02ES E77007210A0 for Surface Mounted Technology Machine Specifications: Brand Name JUKI IC COLLECTING BELT FEEDER Part number E77007210A0 Model RB02ES Ensure Test in machine before shipping
Detailed Product Description Brand: JUKI Part Name: Tape Feeder Part Number: E5005706AB0 Model: AF24FS Condition: Original New Origin: Japan JUKI AF24FS Feeder E5005706AB0 24mm SMT JUKI Feeder For KE2000,KE700 Series Detail Information: 1, Pa
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Automatic PCB router function: Automatic PCB rounter is also called PCB cutting machine,with high speed spindle drying milling kit to cut high density PCBA and other material substrate. Technical specification: Model JW-RM288
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Events Calendar | Thu Dec 05 00:00:00 EST 2019 - Thu Dec 05 00:00:00 EST 2019 | ,
Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database
Events Calendar | Sat Feb 01 00:00:00 EST 2020 - Thu Feb 06 00:00:00 EST 2020 | San Diego, California USA
IPC APEX EXPO 2020
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
; IMPROVES the quality of data collected from your manufacturing floor ELIMINATES the headache of trying to collect, store, access and exchange factory-level data from so many disparate sources