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Industry Directory | Equipment Dealer / Broker / Auctions
Buyer, Seller, Broker of Electronic Assembly Equipment
Leading distributor of more than 64,000 specialty products for the testing, assembly and repair of electronic equipment. We offer test instruments, tools and tool kits, static protection products, adhesives and cleaners and soldering products
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
Electronics Forum | Fri Sep 24 20:02:39 EDT 2004 | pabloquintana
OK, We have tested and changed several things in our process, but we still getting the same result. We are trying another type of coating. We will see later. My question now is what is adhesion wise acceptable in the industry. I know many of you wi
Electronics Forum | Sat Sep 25 08:59:59 EDT 2004 | davef
IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings says: A conformal coating may have several functions depending on the type of application. The most common are: * Inhibit current leakage and short circuit due to h
Used SMT Equipment | SMT Equipment
Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand
Used SMT Equipment | Adhesive Dispensers
Camalot FXD 8000 Dispenser Equipment Description Camalot FXD Model Number: 8000-1 Year 2009 - 2010 Weight Scale Needle Cleaner Laser Height Sensor 635SD Pump (Can be changed to different Pump) (3) Heater Plates (Under fill capable) Dispen
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Pick and Place/Feeders
Base size Max 410 × 360mm Min 50 × 30mm Smudge speed 0.1 seconds / launch(best conditions) Smudge accuracy ± 0.15 mm Needle type 30cc Set the smear angle 0 ° ~ 359 °(1 ° unit) A redesigned dot head. The standard
Parts & Supplies | SMT Equipment
ORIGINAL SMT MACHINE SPARE PARTS JUKI 40044557 1070 1080 2070 2080 XY RELAY PCB JUKI Nozzle Specifications: Brand Name JUKI XY RELAY PCB Part Number 40044557 Model Number Ensure Tested buy juki Guarantee 1 month usage for machine KE2070
Technical Library | 2016-08-24 06:15:35.0
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of dut
Career Center | , | Engineering,Research and Development,Technical Support
For over 50 years, Emerson & Cuming has been designing and manufacturing high performance encapsulants, adhesives, and coatings for the automotive, telecommunications and electronic industries. Our expansive breadth of technologies combined with our
Career Center | Sungai Ara, Penang Malaysia | Management,Sales/Marketing
Spoken skills : English, Malay, Chinese, Cantonese, Korean (Basic) Writing skills : English, Malay, Chinese, Korean (Basic) Computer skills : Microsoft Office (Word, Excel, PowerPoint) Personal : Sense of responsibility, quick learner, can work in
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=21
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