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Industry Directory | Equipment Dealer / Broker / Auctions
Auctioneers, Evaluators & Liquidators. From individual machines to complete facility closings, C3 has been around for 70 years providing value to the secondary marketplace. Find out more about us at www.C3.com.
Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Tue Sep 01 05:28:49 EDT 2009 | aj
start skipping out some parts and try to transmit? could be a dodgy part data... Best thing to do is skip out everything except one part and see how you get on with the transmission and work from there. If it transmits start addin a few more until y
Electronics Forum | Sun Aug 30 15:32:33 EDT 2009 | jimmyboz
most fuji error codes are 8 digits, A21E is 2100A21E, it is a report from the MCS that transmission has failed (we knew that) Hit control E from the main screen of the MCS, there should be another error reported from the cp6, ie. 1101000 is x data ou
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-L2 chip mounter Product number: Samsung DECN-L2 Detailed product introduction By using Vision Head 12Flying to achieve the highest speed 82000CPH Through the flight identification method, the placement of the head movin
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-L2 chip mounter Product number: Samsung DECN-L2 Detailed product introduction By using Vision Head 12Flying to achieve the highest speed 82000CPH Through the flight identification method, the placement of the head movin
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: A
Parts & Supplies | SMT Equipment
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: A
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Wed Feb 19 00:00:00 EST 2020 | Las Vegas, Nevada USA
IPC & WHMA Wire Harness Manufacturing Conference
Events Calendar | Thu Apr 22 00:00:00 EDT 2021 - Thu Apr 22 00:00:00 EDT 2021 | ,
Atlanta Chapter: Tech-Day
Career Center | Portland, Maine USA | Engineering
JOB DESCRIPTION: (4) openings Working as a member of a small team, you will be a major contributor to the next generation of LAN switching and routing products. You will be responsible for the design and verification of complex ASICs from concept thr
Career Center | Rockledge, Florida USA | Purchasing
Primarily responsible for overseeing the purchasing of materials required for production of PCB assemblies. Individual will establish new and alternative supply sources, and negotiate prices and delivery schedules. Individual will communicate with mu
Career Center | Tucson, Texas, Florida, Georgia, Alabama USA | Technical Support
Experienced Field Service Engineer. New installations, emergency calls, preventative maintenence and customer training experience. Territory management and parts inventories.
Career Center | , India | Maintenance
Have worked in ELECTRONICS MANUFACTURING & SEMICONDUCTOR industry for 8+ years for machine maintenance worked with TDK CORPORATION (EPCOS PTE LTD) IN SINGAPORE FOR SEMICONDUCTOR worked with NOKIA INDIA PVT LTD IN INDIA FOR SMT MACHINE MAINTENANCE
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Engineer-to-Engineer Communications by Bill Gotha , Ward Hill Marketing, Inc. Talk about a rock and a
KingFei SMT Tech | https://www.smtspare-parts.com/sale-35705378-kke-m652r-00-smt-spare-parts-ys24-conveyor-in-out-sensor-hp300-d2-out-sensor.html
KKE-M652R-00 SMT Spare Parts YS24 Conveyor In Out Sensor HP300-D2 Out Sensor Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.eptac.com/blog/navigating-the-world-of-electronics-standards
Navigating the World of Electronics Standards: Why IPC Stands Out Looking for solder training standards, manuals, kits, and more
