New Equipment | Rework & Repair Equipment
Shutte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder a
New Equipment | Rework & Repair Equipment
Hot selling optical motherboard BGA chip rework station for laptop/mobile PCBA chip soldering and desoldering Features: 1.Hot air heater head and mounting head are designed 2 in 1, driven by step electric motor, have both the auto soldering a
Electronics Forum | Thu Sep 11 10:45:41 EDT 2008 | diesel_1t
Is just me, or too many "soldering issues" have been observed lately? on this forum... could be a ~90% components "backwards/compatible" in both leaded/lead free process?
Electronics Forum | Mon Jun 26 11:35:23 EDT 2000 | Christopher Lampron
Hello, We have had some problems with electrical testing of molded electrolytic and tant caps on our Mydata machines. It appears that the components will test backwards on a polarized cap test. The Mydata uses the rise time to determine polarity. Doe
Used SMT Equipment | Other Equipment
Motorized electron-optical SMD components counter, works by detecting cut-out holes on SMD reel tapes, accurate and fast. 1, "Pocket Check" Option Tracks Missing Components 2,The automatic counter sets up and changes over fast,count out an enti
Used SMT Equipment | Other Equipment
Motorized electron-optical SMD components counter, works by detecting cut-out holes on SMD reel tapes, accurate and fast. 1, "Pocket Check" Option Tracks Missing Components 2,The automatic counter sets up and changes over fast,count out an enti
Industry News | 2021-02-04 10:54:09.0
The USB4 can Simultaneously Transfer both Audio and Video over the Same Connection at speeds up to 40Gbps
Industry News | 2014-03-18 10:41:09.0
Seika Machinery, Inc. has introduced the new UA1780 Fit-Line Inspection Data Creation System to support the new HIOKI FA1240 Flying Probe Tester.
Parts & Supplies | Component Packaging
J9080328B Z2 MOTOR CABLE[CP60HP-TH-HD-01-02] J7066239A REEL POST 24[SM1-MF24-016-04] J7265173A REMO TAKE UP REEL 24[SM1-MF24-041-01] J7066253A REMO VINYL RING 24[SM1-MF24-041-02] J9055357A PULLEY ASSY (Z-AXIS 2) J6606016C BALL SCREW-Y[WGF2550E-3
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
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Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/new-manual-pneumatic-and-cordless-guns-for-dispensing-2k-adhesives-4-29-14
Nordson EFD Offers New Manual, Pneumatic, and Cordless Guns for Dispensing Two-Component Adhesive Materials Nordson EFD Corporate | Global Directory
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