Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Fri Aug 16 17:08:07 EDT 2002 | davef
Could be. It does indicate imperfection. * �The component was manufactured and shipped correctly and should not need baking in order to use it.� => Sounds good. Most classes of MSD packaging have a self-life. Lots of times it�s expired before it
Electronics Forum | Thu Mar 07 06:20:36 EST 2002 | HCC
Hi y'all, I know this could be sensitive information, but can I just start up a benchmarking sharing on the missing component rate in Fuji CP742 chipshooter? We've been seeing quite a few missing RLC components, and even some components that end up
Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost
We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo
Electronics Forum | Mon Jan 18 12:59:29 EST 2010 | deanm
Looking to find out what materials are commonly used for staking (aka. bonding) through hole components to the PCB in order to withstand vibration in a military (class 3) environment. Polyurethane coating would be applied after staking. I've found st
Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus
Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill
Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88
I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.
