Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code
Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t
Electronics Forum | Mon Jul 10 11:38:15 EDT 2006 | Rob
Hi Dougs, I think I'm going to have to admit to some insider knowledge here. It kind of gave it away when you mentioned there were only catalogue pages instead of specs. http://www.anglia.com/product_search/part_tracker/index.asp I think you may
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Agilent 3499A 5-Slot Switch/Control Mainframe Switch/Control Mainframe The Agilent 3499 family provides a high-speed, high-density electronic/optical switching solution for automatic test engineering (ATE) applications, with a 30% cost and sp
Agilent 3499B Switch/Control Mainframe The Agilent 3499 family provides a high-speed, high-density electronic/optical switching solution for automatic test engineering (ATE) applications, with a 30% cost and space savings over its predecessor, th
Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company’s new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Industry News | 2003-06-26 08:12:04.0
He replaces Robert J. Schutz
VG Mass Interconnect is a series of modular fixture products that allows quick connection between the UUT (unit under test) and a custom test system. VG mass interconnect is divided into 2 segments: Receivers (Tester Side), and Fixture Kits (DUT
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
Career Center | Milpitas, California USA | Production,Quality Control
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking an experienced, detail-oriented, quality-conscious team player for our Quality Assur
Career Center | Milpitas, USA | Engineering,Maintenance
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a high energy, creative, hands-on electro-mechanical engineer to join our team. Thi
Career Center | Danville, California | Sales/Marketing
Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell firstname.lastname@example.org OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
. Utilizing the industry’s latest tools, materials and technology, students will perform a variety of IPC 7711 through-hole and surface mount component rework and inspection processes