Industry Directory: component interconnections (40)

New SMT Equipment: component interconnections (1657)

Component Identification Training

Component Identification Training

New Equipment | Education/Training

Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code

EPTAC Corporation

IPC Advance Design Certification

IPC Advance Design Certification

New Equipment | Education/Training

Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t

EPTAC Corporation

Electronics Forum: component interconnections (47)

Intrusive reflow component selection

Electronics Forum | Mon Jul 10 11:38:15 EDT 2006 | Rob

Hi Dougs, I think I'm going to have to admit to some insider knowledge here. It kind of gave it away when you mentioned there were only catalogue pages instead of specs. http://www.anglia.com/product_search/part_tracker/index.asp I think you may

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

Used SMT Equipment: component interconnections (11)

Agilent 3499A

Agilent 3499A

Used SMT Equipment | In-Circuit Testers

Agilent 3499A 5-Slot Switch/Control Mainframe Switch/Control Mainframe The Agilent 3499 family provides a high-speed, high-density electronic/optical switching solution for automatic test engineering (ATE) applications, with a 30% cost and sp

Test Equipment Connection

Agilent 3499B

Agilent 3499B

Used SMT Equipment | In-Circuit Testers

Agilent 3499B Switch/Control Mainframe The Agilent 3499 family provides a high-speed, high-density electronic/optical switching solution for automatic test engineering (ATE) applications, with a 30% cost and space savings over its predecessor, th

Test Equipment Connection

Industry News: component interconnections (380)

GPD Global to Debut New Technology for Fine Line and Nano Shot Dispensing at SEMICON West 2013

Industry News | 2013-06-10 17:08:51.0

GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company’s new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.

GPD Global

Parts & Supplies: component interconnections (1)

Juki VG Mass Interconnect

Juki VG Mass Interconnect

Parts & Supplies | Hand Assembly

VG Mass Interconnect is a series of modular fixture products that allows quick connection between the UUT (unit under test) and a custom test system. VG mass interconnect is divided into 2 segments: Receivers (Tester Side), and Fixture Kits (DUT

Shenzhen PTI Technology CO.,LTD

Technical Library: component interconnections (20)

Advanced Packaging Technology

Technical Library | 2019-10-16 10:20:25.0

A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.

ACI Technologies, Inc.

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

ASYMTEK Products | Nordson Electronics Solutions

Videos: component interconnections (7)

Electronics in Harsh Environments Conference 2019 Summary

Electronics in Harsh Environments Conference 2019 Summary

Videos

Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh

Surface Mount Technology Association (SMTA)

Yamaha S20 Modular Pick and Place Machine

Videos

Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: component interconnections (49)

Component Indentification Certification

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Component Identification Online Live Certification

Training Courses | ON DEMAND | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Events Calendar: component interconnections (12)

IPC SummerCom

Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA

IPC SummerCom

Association Connecting Electronics Industries (IPC)

Electronics in Harsh Environments Conference

Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA)

Career Center - Jobs: component interconnections (7)

Quality Inspector

Career Center | Milpitas, California USA | Production,Quality Control

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking an experienced, detail-oriented, quality-conscious team player for our Quality Assur

Winslow Automation (aka Six Sigma)

Mechanical Equipment Engineer

Career Center | Milpitas, USA | Engineering,Maintenance

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a high energy, creative, hands-on electro-mechanical engineer to join our team. Thi

Winslow Automation (aka Six Sigma)

Career Center - Resumes: component interconnections (5)

Bob Riemer's resume

Career Center | Danville, California | Sales/Marketing

Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Express Newsletter: component interconnections (994)

Partner Websites: component interconnections (87)


component interconnections searches for Companies, Equipment, Machines, Suppliers & Information

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Pillarhouse USA for Selective Soldering Needs

World Source Equipment: Used equipment sale. Hundreds of items on sale.


Component Placement 101 Training Course
High Throughput Reflow Oven

Stencil Printing 101 Training Course