Electronics Forum | Mon Jul 10 11:38:15 EDT 2006 | Rob
Hi Dougs, I think I'm going to have to admit to some insider knowledge here. It kind of gave it away when you mentioned there were only catalogue pages instead of specs. http://www.anglia.com/product_search/part_tracker/index.asp I think you may
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Thu Jul 31 08:20:06 EDT 2008 | davef
Not quite what you'ree looking for, but may be interesting: JESD22B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products http://www.akrometrix.com/industrydocs/JESD22B113
Electronics Forum | Wed Sep 02 17:29:51 EDT 1998 | Dave F
| How would you mount a surface mount chip onto Perf board? I am doing a project for school and one of the chips is a surface mount, but everything else fits in Perf board. Any suggestions? Thanks Matt: Here's one way to do it: 1 Get a hot glue
Electronics Forum | Fri Aug 03 09:58:20 EDT 2007 | stepheniii
And that's better because? I think the guy that thought this up has never been to a board shop or knows what is involved with plating. Why does he think it's the board shops that will disappear? Maybe they will simply build the board over the compon
Electronics Forum | Sat Jan 07 04:00:12 EST 2017 | soldertraining
Electronic components distributor offering semiconductors, interconnects, electro-mechanical, power supplies, PCB Repair, BGA rework and measurement equipment. In order to select the electronic distributor we must remain updated with Technology news
Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon
We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf
I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
