Electronics Forum | Mon Jun 07 18:00:06 EDT 2004 | Rob
Board is .09" thick not .9". Sorry
Electronics Forum | Mon Jun 07 14:16:20 EDT 2004 | Rob
I've been approached by my design engineer who would like to know what is the largest component I can place on the secondary side of a double-sided PCB (without adhesive or glue) and not have it fall off when I run the top side. Currently, I can plac
Electronics Forum | Mon Jun 07 17:07:42 EDT 2004 | russ
the only components I have had trouble with so far are PLCC68 and larger, Large Coils (2b and 3b size) Heavy crystals. Some BGAs if they are not PBGAs. There was a discussion on this and a formula was given to determine if a part will hang under th
Electronics Forum | Mon Jun 07 14:47:22 EDT 2004 | Mark
It matters on how you setup your oven profile. I have placed J-leads on both sides with no problems. Also, have come across some fine pitch but wouldnt suggest this too often. Give some examples that he would like to see placed on the bottom side of
Electronics Forum | Mon Jun 07 21:31:46 EDT 2004 | davef
That's thin board. The test that you ran is the best method for determining the specific answer. Bob Willis says, "Use pad mating to lead wetting area. Some have found the ratio to be as much as 44 grams/sq in." Bob Willis and Phil Zarrow have po
Electronics Forum | Mon Jun 07 17:58:12 EDT 2004 | Rob
UPDATE: Just for fun... I sacrificed a scrapped board to determine what remained and what fell and this is the result. Board dimension was 18"x9" and .9" thick. Components consist of hundreds of passives plus 386 proc (QFP256), TSOPs, SOLs 14/16/20,
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Tue Jan 17 11:52:07 EST 2006 | pms
Got a wierd one here, 0402's tomb-stoning. Scenerio---- Double sided PCB, paste both sides, 0402 on both sides. Reflow bottom side first--- no problems. Reflow topside next----no problems with topside components, BUT, the bottom side that was ref
Electronics Forum | Wed Dec 12 09:46:32 EST 2012 | rway
You can go with smaller chip parts (0805 to 0603 or smaller). What size is D1? Can you go to a smaller package. Provide more details. You may not have the real estate to include the silksreen (i.e. reference designators). Consider omitting them.
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