New Equipment | Design Services
Two part compound silicones polyurethane Black Epoxy Potting Compounds urethane potting for thyristor IGBT SCR Rectifier modules Metering Mixing and Dispensing Machine PU Resin Dynamic Polyurethane Dosing System Automatic Epoxy Resin Filling Machine
New Equipment | Coating Equipment
Plasma treatment prior to conformal coating addresses these detrimental manufacturing issues: Removes organic contaminants Eliminates flux and mold release residue Enhances surface wettability Enhances lead coverage Improves adhesion Systems
Electronics Forum | Thu Nov 10 07:57:51 EST 2005 | davef
AJ: Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed from the stencil. * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Flash point (~12*C TCC) of IPA is low enough that a
Electronics Forum | Fri Jul 16 14:02:03 EDT 1999 | Timothy O'Neill
| Earl, | | Srt makes a system called the summit 2100D. Its a relatively new product but it is designed for rework applications. The programming is simple and interfaces well with other srt products. As with any dispensing system, you have to cl
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2020-10-03 08:34:38.0
MIRTEC is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
Parts & Supplies | Pick and Place/Feeders
YAMAHA FT8 * 4 feeder for SMT equipment Product Name: YAMAHA, FT8 * 4 feeder Product Specifications: FT8 * 4 Description: YAMAHA, YG12 series Mounter Compound aircraft. Promotion Description: Our company have original and generic YAMAHA feede
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
SMTnet Express, October 5, 2017, Subscribers: 30,900, Companies: 10,753, Users: 23,894 Intermetallic Compounds In Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders Torsten Geipel, Achim Kraft, Ulrich Eitner - ISE , Monja
Heller Industries Inc. | https://hellerindustries.com/parts/8131/
8131 - Heat sink compound - TYPE 44NON-SILICONE - 1LB Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Blackfox Training Institute, LLC | https://www.blackfox.com/4-key-attributes-that-pcbs-need-for-aerospace-deployment/
. Thermal compound is also commonly used for insulating heat and preventing it from transferring to other electronic components. Leaving a space between the components and the
